Qualcomm Snapdragon 7c+ Gen 3 vs Intel Core Ultra 5 336H Full Specs
12 Cores(8P+4E) 12 Threads(8P+4E) 2.55GHz | 12 Cores(4P+4M+4E) 12 Threads(4P+4M+4E) 1.9GHz |
TDP - | TDP 25W |
Bandwidth 25.6GB/s · | Bandwidth 136.5GB/s · |
iGPU | iGPU |
·· 844.8 GFLOPSFP16 | ·· 75.37 TFLOPSFP16 |
Socket - | Socket |
Snapdragon 7c+ Gen 3974
Core Ultra 5 336H-12 Cores 8P - 4E | 12 Cores 4P 4M 4E |
12 Threads 8P - 4E | 12 Threads 4P 4M 4E |
Base Clock 2.55GHz | Base Clock 1.9GHz |
Boost Clock - | Boost Clock 4.6GHz |
Overclocking Locked | Overclocking Locked |
L0i - | L0i 64KB |
L0d - | L0d 48KB |
L1i 64KB P - 32KB E | L1i - 64KB M 64KB E |
L1d 64KB P - 32KB E | L1d 192KB P 32KB M 32KB E |
L2 512KB P 128KB E - - | L2 3MB P - 4MB M shared 4MB E shared |
L3 - | L3 18MB |
Type · | Type · |
Max Memory 24GB | Max Memory 96GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 32-bit | Bus Width 128-bit |
Speed 6400MT/s | Speed 8533MT/s |
Bandwidth 25.6GB/s | Bandwidth 136.5GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 25.6GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 136.5GB/s |
TDP - | TDP 25W |
cTDP-down - | cTDP-down 15W |
Peak Power - | Peak Power 80W |
Max Operating Temp - | Max Operating Temp 100°C Max |
- | PCIe PCIe 5.0 x1247.3GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x815.8GB/sBandwidth |
iGPU | iGPU |
Shaders 256 | Shaders 512 |
Boost Clock 825MHz | Boost Clock 2.3GHz |
·· 844.8 GFLOPSFP16 | ·· 75.37 TFLOPSFP16 |
NPU Model Hexagon | NPU Model NPU 5 |
NPU Cores - | NPU Cores 3 |
Performance 6.5 TOPS | Performance 47 TOPSINT8 |
Modem Model X53 | Modem Model - |
Cellular 5G mmWave | Cellular - |
Peak Down Up to 3.7Gbps | Peak Down - |
Peak Up Up to 2.9Gbps | Peak Up - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture KryoARMv8.2-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename - - Cortex-A78P-Core - Cortex-A55E-Core | Codename Panther Lake-H Panther Lake-H-4P-12EVariant Cougar CoveP-Core DarkmontM-Core DarkmontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Dec 22, 2021 | Release Date Jan 5, 2026 |
Foundry TSMC | Foundry Intel |
Other Foundries - | Other Foundries InteliGPU TSMCPCH |
Fabrication Node N6 - - | Fabrication Node Intel 18A Intel 3iGPU N6PCH |
Die Size - | Die Size 114mm² 27mm²iGPU 56mm²PCH |
Transistor Count - | Transistor Count 12 MillionPCH |
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