Qualcomm Snapdragon 7s Gen 3 vs Qualcomm Snapdragon 8 Gen 1 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.5GHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3GHz
TDP -	TDP 5W
Bandwidth 25.6GB/s LPDDR5	Bandwidth 51.2GB/s LPDDR5
iGPU Adreno 810	iGPU Adreno 730
Peak·FP32·FP16 1.07 TFLOPSFP16	Peak·FP32·FP16 3.35 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 7s Gen 31,173

x1

Snapdragon 8 Gen 11,311

x1.12

Show Top Score

Core Config

8 Cores 1P 3M 4E	8 Cores 1P 3M 4E
8 Threads 1P 3M 4E	8 Threads 1P 3M 4E

Clocks

Base Clock 2.5GHz	Base Clock 3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 64KB P 64KB M 32KB E
L1d 64KB P 64KB M 32KB E	L1d 64KB P 64KB M 32KB E
L2 512KB P 512KB M 128KB E	L2 1MB P 512KB M 128KB E
L3 -	L3 6MB
SLC Cache 1MB	SLC Cache 4MB

Memory

Type LPDDR5	Type LPDDR5
Max Memory 16GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 32-bit	Bus Width 64-bit
Speed 6400MT/s	Speed 6400MT/s
Bandwidth 25.6GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

TDP -

TDP 5W

iGPU

iGPU Adreno 810	iGPU Adreno 730
Shaders 256	Shaders 1024
Boost Clock 1.05GHz	Boost Clock 818MHz
Peak·FP32·FP16 1.07 TFLOPSFP16	Peak·FP32·FP16 3.35 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model Hexagon
Performance -	Performance 52 TOPSINT4

Cellular

Modem Model X63	Modem Model X65
Cellular 5G mmWave	Cellular 5G mmWave
Peak Down Up to 5.0Gbps	Peak Down Up to 10.0Gbps
Peak Up Up to 1.6Gbps	Peak Up Up to 3.0Gbps

Chip

Manufacturer Qualcomm	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture KryoARMv9.2-A	Architecture KryoARMv9.0-A
Family 7 Series	Family 8 Series
Branding	Branding
Codename - Cortex-A720P-Core Cortex-A720M-Core Cortex-A520E-Core	Codename Snapdragon 8 Gen 1Variant Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Aug 1, 2024	Release Date Oct 5, 2021

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N6	Fabrication Node 4LPE
Die Size -	Die Size 129mm²

Images

No images available

No images available

Used In

Smartphones Nothing Phone 3aNothing Phone 3a Pro	Smartphones Galaxy S23 FEGalaxy S22Galaxy S22+ Show 2 more
Tablets -	Tablets Galaxy Tab S8(SD 8G1, Early 2022)Galaxy Tab S8+(SD 8G1, Early 2022)Galaxy Tab S8 Ultra(SD 8G1, Early 2022)

Competitors

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