Qualcomm Snapdragon 8 Elite Galaxy vs Qualcomm Snapdragon 808+ Full Specs

Summary

8 Cores(2P+6E) 8 Threads(2P+6E) 4.47GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz
TDP 5W	TDP 5W
Bandwidth 84.8GB/s LPDDR5X	Bandwidth 25.6GB/s LPDDR4
iGPU Adreno 830	iGPU Adreno 430+
Peak·FP32·FP16 6.76 TFLOPSFP16	Peak·FP32·FP16 483.8 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 8 Elite Galaxy3,220

x1

Snapdragon 808+-

-

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Core Config

8 Cores 2P 6E	8 Cores 4P 4E
8 Threads 2P 6E	8 Threads 4P 4E

Clocks

Base Clock 4.47GHz	Base Clock 2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 128KB P 64KB E	L1i 32KB P 16KB E
L1d 64KB P 64KB E	L1d 32KB P 16KB E
L2 12MB P shared 12MB E shared	L2 512KB P shared 1MB E shared
SLC Cache 8MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR4
Max Memory 24GB	Max Memory 8GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 64-bit	Bus Width 64-bit
Speed 10600MT/s	Speed 3200MT/s
Bandwidth 84.8GB/s	Bandwidth 25.6GB/s
Bandwidth Calculator Channels Transfer Rate10600MT/s Calculated Bandwidth 84.8GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 25.6GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power 17W	Peak Power -

iGPU

iGPU Adreno 830	iGPU Adreno 430+
Shaders 1536	Shaders 192
Boost Clock 1.1GHz	Boost Clock 630MHz
Peak·FP32·FP16 6.76 TFLOPSFP16	Peak·FP32·FP16 483.8 GFLOPSFP16

NPU

NPU Model Hexagon	NPU Model Hexagon V56
NPU Clock -	NPU Clock 800MHz
Performance 45 TOPSINT8	Performance -

Cellular

Modem Model X80	Modem Model X10
Cellular 5G mmWave	Cellular LTE
Peak Down Up to 10.0Gbps	Peak Down Up to 450Mbps
Peak Up Up to 3.5Gbps	Peak Up Up to 50Mbps

Chip

Manufacturer Qualcomm	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Oryon 2ARMv8.7-A	Architecture ARMv8.0-A
Family 8 Series	Family 8 Series
Branding	Branding
Codename Snapdragon 8 EliteVariant Phoenix-PP-Core Phoenix-EE-Core	Codename - Cortex-A57P-Core Cortex-A53E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Oct 21, 2024	Release Date Jul 1, 2015

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3E	Fabrication Node 28nm LP
Die Size 124mm²	Die Size -

Images

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Used In

Smartphones Galaxy S25Galaxy S25+Galaxy S25 Ultra

Smartphones -

Competitors

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