Qualcomm Snapdragon 8 Gen 1 vs Apple A9 (Samsung) Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3GHz	2 Cores 2 Threads 1.85GHz
TDP 5W	TDP 5W
Bandwidth 51.2GB/s LPDDR5	Bandwidth 25.6GB/s LPDDR4
iGPU Adreno 730	iGPU PowerVR GT7600 A9
Peak·FP32·FP16 3.35 TFLOPSFP16	Peak·FP32·FP16 499.2 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 8 Gen 11,311

x2.04

A9 (Samsung)644

x1

Show Top Score

Core Config

8 Cores 1P 3M 4E	2 Cores 2P - -
8 Threads 1P 3M 4E	2 Threads 2P - -

Clocks

Base Clock 3GHz	Base Clock 1.85GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 64KB P - -
L1d 64KB P 64KB M 32KB E	L1d 64KB P - -
L2 1MB P 512KB M 128KB E -	L2 3MB P shared
L3 6MB	L3 4MB
SLC Cache 4MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR4
Max Memory 24GB	Max Memory 2GB
ECC No	ECC No
Channels 4	Channels 1
Bus Width 64-bit	Bus Width 64-bit
Speed 6400MT/s	Speed 3200MT/s
Bandwidth 51.2GB/s	Bandwidth 25.6GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 25.6GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Adreno 730	iGPU PowerVR GT7600 A9
Shaders 1024	Shaders 192
Boost Clock 818MHz	Boost Clock 650MHz
Peak·FP32·FP16 3.35 TFLOPSFP16	Peak·FP32·FP16 499.2 GFLOPSFP16

NPU

NPU Model Hexagon	NPU Model -
Performance 52 TOPSINT4	Performance -

Cellular

Modem Model X65	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 10.0Gbps	Peak Down -
Peak Up Up to 3.0Gbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture KryoARMv9.0-A	Architecture Apple Silicon 4ARMv8.0-A
Family 8 Series	Family A Series
Branding	Branding
Codename - Snapdragon 8 Gen 1Variant Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core	Codename Maui A9 SamsungVariant TwisterP-Core - -
Market Segment Smartphone	Market Segment Smartphone
Release Date Oct 5, 2021	Release Date Sep 25, 2015

Fabrication

Foundry Samsung	Foundry Samsung
Fabrication Node 4LPE	Fabrication Node 14LPP
Die Size 129mm²	Die Size 96mm²
Transistor Count -	Transistor Count 2.5 Billion
Transistor Density -	Transistor Density 26 MTr/mm²

Images

No images available

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Used In

Smartphones Galaxy S23 FEGalaxy S22Galaxy S22+ Show 2 more	Smartphones iPhone 6SiPhone SE(Gen 1)
Tablets Galaxy Tab S8(SD 8G1, Early 2022)Galaxy Tab S8+(SD 8G1, Early 2022)Galaxy Tab S8 Ultra(SD 8G1, Early 2022)	Tablets iPad 5(A9, Early 2017)

Competitors

QualcommSnapdragon 8 Gen 1 vs CPU QualcommSnapdragon 8 Elite Gen 5 QualcommSnapdragon 8 Gen 1 vs CPU QualcommSnapdragon 8 Elite QualcommSnapdragon 8 Gen 1 vs CPU QualcommSnapdragon 8 Elite Galaxy Show 12 more

AppleA9 (Samsung) vs CPU AppleA18 Pro (Neo) AppleA9 (Samsung) vs CPU AppleA19 (17e) AppleA9 (Samsung) vs CPU AppleA19 Pro Show 12 more