Qualcomm Snapdragon 8 Gen 1 vs Intel Core i3-1005G1 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3GHz	2 Cores 4 Threads 1.2GHz
TDP 5W	TDP 15W
Bandwidth 51.2GB/s LPDDR5	Bandwidth 59.7GB/s LPDDR4·DDR4
iGPU Adreno 730	iGPU UHD 32EU 900MHz Gen 11
Peak·FP32·FP16 3.35 TFLOPSFP16	Peak·FP32·FP16 921.6 GFLOPSFP16
Socket -	Socket BGA 1526

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 8 Gen 11,311

x1.01

Core i3-1005G11,304

x1

Show Top Score

Core Config

8 Cores 1P 3M 4E	2 Cores 2P - -
8 Threads 1P 3M 4E	4 Threads 4P - -

Clocks

Base Clock 3GHz	Base Clock 1.2GHz
Boost Clock -	Boost Clock 3.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 32KB P - -
L1d 64KB P 64KB M 32KB E	L1d 48KB P - -
L2 1MB P 512KB M 128KB E	L2 512KB P - -
L3 6MB	L3 4MB
SLC Cache 4MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR4·DDR4
Max Memory 24GB	Max Memory 32GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 3733MT/s
Bandwidth 51.2GB/s	Bandwidth 59.7GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 59.7GB/s

Power & Thermals

TDP 5W	TDP 15W
cTDP-down -	cTDP-down 13W
cTDP-up -	cTDP-up 25W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 2GB/s

Expansion

-	PCIe PCIe 3.0 x8 7.9GB/sBandwidth

iGPU

iGPU Adreno 730	iGPU UHD 32EU 900MHz Gen 11
Shaders 1024	Shaders 256
Boost Clock 818MHz	Boost Clock 900MHz
Peak·FP32·FP16 3.35 TFLOPSFP16	Peak·FP32·FP16 921.6 GFLOPSFP16

NPU

NPU Model Hexagon	NPU Model GNA 1.0
Performance 52 TOPSINT4	Performance -

Cellular

Modem Model X65	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 10.0Gbps	Peak Down -
Peak Up Up to 3.0Gbps	Peak Up -

Controller

Controller Model -	Controller Model 495 Series U+
Codename -	Codename Ice Lake
PCIe -	PCIe -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture KryoARMv9.0-A	Architecture Ice Lake
Family 8 Series	Family Core 10th Gen
Branding	Branding
Codename - Snapdragon 8 Gen 1Variant Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core	Codename Ice Lake-U - Sunny CoveP-Core - -
Market Segment Smartphone	Market Segment Laptop
Release Date Oct 5, 2021	Release Date Aug 1, 2019

Fabrication

Foundry Samsung	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node 4LPE -	Fabrication Node 10nm+ 14nmPCH
Die Size 129mm² -	Die Size 122mm² 54mm²PCH
Transistor Count -	Transistor Count 7 Billion
Transistor Density -	Transistor Density 57 MTr/mm²

Images

No images available

No images available

Used In

Smartphones Galaxy S23 FEGalaxy S22Galaxy S22+ Show 2 more	Smartphones -
Tablets Galaxy Tab S8(SD 8G1, Early 2022)Galaxy Tab S8+(SD 8G1, Early 2022)Galaxy Tab S8 Ultra(SD 8G1, Early 2022)	Tablets Surface Pro 7(Intel 10th Gen, Late 2019)

Competitors

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