CPUs

Qualcomm Snapdragon 8 Gen 1 vs Intel Core i5-8250U Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3GHz
4 Cores
8 Threads
1.6GHz
TDP
5W
TDP
15W
Bandwidth
51.2GB/s
LPDDR5
Bandwidth
34.1GB/s
··
iGPU
iGPU
··
3.35 TFLOPSFP16
··
422.4 GFLOPSFP16
Socket
-
Socket

Snapdragon 8 Gen 1Snapdragon 8 Gen 11,311
x1.17
Core i5-8250UCore i5-8250U1,124
x1

8 Cores
1P
3M
4E
4 Cores
4P
-
-
8 Threads
1P
3M
4E
8 Threads
8P
-
-

Base Clock
3GHz
Base Clock
1.6GHz
Boost Clock
-
Boost Clock
3.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
32KB P
-
-
L1d
64KB P
64KB M
32KB E
L1d
32KB P
-
-
L2
1MB P
512KB M
128KB E
L2
256KB P
-
-
L3
6MB
L3
6MB
SLC Cache
4MB
SLC Cache
-

Type
LPDDR5
Type
··
Max Memory
24GB
Max Memory
32GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
128-bit
Speed
6400MT/s
Speed
2133MT/s
Bandwidth
51.2GB/s
Bandwidth
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
34.1GB/s

TDP
5W
TDP
15W
cTDP-down
-
cTDP-down
10W
cTDP-up
-
cTDP-up
25W
Max Operating Temp
-
Max Operating Temp
100°C Max

Bus Type
-
Bus Type
OPI
Bus Config
-
Bus Config
4 lanes
Bus Speed
-
Bus Speed
4GT/s
Bus Bandwidth
-
Bus Bandwidth
2GB/s

-
PCIe
PCIe 3.0 x12
11.8GB/sBandwidth

iGPU
iGPU
Shaders
1024
Shaders
192
Boost Clock
818MHz
Boost Clock
1.1GHz
··
3.35 TFLOPSFP16
··
422.4 GFLOPSFP16

NPU Model
Hexagon
NPU Model
-
Performance
52 TOPSINT4
Performance
-

Modem Model
X65
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 10.0Gbps
Peak Down
-
Peak Up
Up to 3.0Gbps
Peak Up
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
KryoARMv9.0-A
Architecture
Family
Family
Branding
Snapdragon 8 Gen 1  branding
Branding
Core i5 2016 branding
Codename
-
Snapdragon 8 Gen 1Variant
Cortex-X2P-Core
Cortex-A710M-Core
Cortex-A510E-Core
Codename
Kaby Lake-R
Kaby Lake-R-4C-GT2Variant
-
-
-
Market Segment
Smartphone
Market Segment
Laptop
Release Date
Oct 5, 2021
Release Date
Aug 21, 2017

Foundry
Samsung
Foundry
Intel
Fabrication Node
4LPE
Fabrication Node
14nm+
Die Size
129mm²
Die Size
123mm²
Transistor Count
-
Transistor Count
2.1 Billion
Transistor Density
-
Transistor Density
17 MTr/mm²

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