Qualcomm Snapdragon 8 Gen 3 vs Intel Core i3-1005G1 Full Specs
8 Cores(1P+5M+2E) 8 Threads(1P+5M+2E) 3.3GHz | 2 Cores 4 Threads 1.2GHz |
TDP 5W | TDP 15W |
Bandwidth 76.8GB/s LPDDR5X | Bandwidth 59.7GB/s · |
iGPU | iGPU |
·· 5.53 TFLOPSFP16 | ·· 921.6 GFLOPSFP16 |
Socket - | Socket |
8 Cores 1P 5M 2E | 2 Cores 2P - - |
8 Threads 1P 5M 2E | 4 Threads 4P - - |
Base Clock 3.3GHz | Base Clock 1.2GHz |
Boost Clock - | Boost Clock 3.4GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 32KB P - - |
L1d 64KB P 64KB M 32KB E | L1d 48KB P - - |
L2 1MB P 512KB M 128KB E | L2 512KB P - - |
L3 12MB | L3 4MB |
SLC Cache 4MB | SLC Cache - |
Type LPDDR5X | Type · |
Max Memory 24GB | Max Memory 32GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 64-bit | Bus Width 128-bit |
Speed 9600MT/s | Speed 3733MT/s |
Bandwidth 76.8GB/s | Bandwidth 59.7GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 76.8GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 59.7GB/s |
TDP 5W | TDP 15W |
cTDP-down - | cTDP-down 13W |
cTDP-up - | cTDP-up 25W |
Max Operating Temp - | Max Operating Temp 100°C Max |
Bus Type - | Bus Type OPI |
Bus Config - | Bus Config 4 lanes |
Bus Speed - | Bus Speed 4GT/s |
Bus Bandwidth - | Bus Bandwidth 2GB/s |
- | PCIe PCIe 3.0 x87.9GB/sBandwidth |
iGPU | iGPU |
Shaders 1536 | Shaders 256 |
Boost Clock 900MHz | Boost Clock 900MHz |
·· 5.53 TFLOPSFP16 | ·· 921.6 GFLOPSFP16 |
NPU Model Hexagon | NPU Model GNA 1.0 |
Performance 45 TOPSINT8 | Performance - |
Modem Model X75 | Modem Model - |
Cellular 5G mmWave | Cellular - |
Peak Down Up to 10.0Gbps | Peak Down - |
Peak Up Up to 3.5Gbps | Peak Up - |
Controller Model - | Controller Model 495 Series U+ |
Codename - | Codename Ice Lake |
PCIe - | PCIe - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture KryoARMv9.0-A | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename - Snapdragon 8 Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core | Codename Ice Lake-U - Sunny CoveP-Core - - |
Market Segment Smartphone | Market Segment Laptop |
Release Date Oct 24, 2023 | Release Date Aug 1, 2019 |
Foundry TSMC | Foundry Intel |
Other Foundries - | Other Foundries IntelPCH |
Fabrication Node N4P - | Fabrication Node 10nm+ 14nmPCH |
Die Size 137mm² - | Die Size 122mm² 54mm²PCH |
Transistor Count - | Transistor Count 7 Billion |
Transistor Density - | Transistor Density 57 MTr/mm² |
No images available
No images available
Smartphones | Smartphones - |
Tablets | Tablets |



