CPUs

Qualcomm Snapdragon 8 Gen 3 vs Intel Core i3-1005G1 Full Specs

8 Cores(1P+5M+2E)
8 Threads(1P+5M+2E)
3.3GHz
2 Cores
4 Threads
1.2GHz
TDP
5W
TDP
15W
Bandwidth
76.8GB/s
LPDDR5X
Bandwidth
59.7GB/s
·
iGPU
iGPU
··
5.53 TFLOPSFP16
··
921.6 GFLOPSFP16
Socket
-
Socket

Snapdragon 8 Gen 3Snapdragon 8 Gen 32,128
x1.63
Core i3-1005G1Core i3-1005G11,304
x1

8 Cores
1P
5M
2E
2 Cores
2P
-
-
8 Threads
1P
5M
2E
4 Threads
4P
-
-

Base Clock
3.3GHz
Base Clock
1.2GHz
Boost Clock
-
Boost Clock
3.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
32KB P
-
-
L1d
64KB P
64KB M
32KB E
L1d
48KB P
-
-
L2
1MB P
512KB M
128KB E
L2
512KB P
-
-
L3
12MB
L3
4MB
SLC Cache
4MB
SLC Cache
-

Type
LPDDR5X
Type
·
Max Memory
24GB
Max Memory
32GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
128-bit
Speed
9600MT/s
Speed
3733MT/s
Bandwidth
76.8GB/s
Bandwidth
59.7GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
59.7GB/s

TDP
5W
TDP
15W
cTDP-down
-
cTDP-down
13W
cTDP-up
-
cTDP-up
25W
Max Operating Temp
-
Max Operating Temp
100°C Max

Bus Type
-
Bus Type
OPI
Bus Config
-
Bus Config
4 lanes
Bus Speed
-
Bus Speed
4GT/s
Bus Bandwidth
-
Bus Bandwidth
2GB/s

-
PCIe
PCIe 3.0 x8
7.9GB/sBandwidth

iGPU
iGPU
Shaders
1536
Shaders
256
Boost Clock
900MHz
Boost Clock
900MHz
··
5.53 TFLOPSFP16
··
921.6 GFLOPSFP16

NPU Model
Hexagon
NPU Model
GNA 1.0
Performance
45 TOPSINT8
Performance
-

Modem Model
X75
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 10.0Gbps
Peak Down
-
Peak Up
Up to 3.5Gbps
Peak Up
-

Controller Model
-
Controller Model
495 Series U+
Codename
-
Codename
Ice Lake
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
KryoARMv9.0-A
Architecture
Family
Family
Branding
Snapdragon 8 Gen 3  branding
Branding
Core i3 2019 branding
Codename
-
Snapdragon 8 Gen 3Variant
Cortex-X4P-Core
Cortex-A720M-Core
Cortex-A520E-Core
Codename
Ice Lake-U
-
Sunny CoveP-Core
-
-
Market Segment
Smartphone
Market Segment
Laptop
Release Date
Oct 24, 2023
Release Date
Aug 1, 2019

Foundry
TSMC
Foundry
Intel
Other Foundries
-
Other Foundries
IntelPCH
Fabrication Node
N4P
-
Fabrication Node
10nm+
14nmPCH
Die Size
137mm²
-
Die Size
122mm²
54mm²PCH
Transistor Count
-
Transistor Count
7 Billion
Transistor Density
-
Transistor Density
57 MTr/mm²

No images available
No images available