CPUs

Qualcomm Snapdragon 8 Gen 3 vs Intel Core Ultra 5 135U Full Specs

8 Cores(1P+5M+2E)
8 Threads(1P+5M+2E)
3.3GHz
12 Cores(2P+8M+2E)
14 Threads(4P+8M+2E)
1.6GHz
TDP
5W
TDP
15W
Bandwidth
76.8GB/s
LPDDR5X
Bandwidth
119.5GB/s
·
iGPU
iGPU
··
5.53 TFLOPSFP16
··
3.89 TFLOPSFP16
Socket
-
Socket

Snapdragon 8 Gen 3Snapdragon 8 Gen 32,128
x1
Core Ultra 5 135UCore Ultra 5 135U2,135
x1.00

8 Cores
1P
5M
2E
12 Cores
2P
8M
2E
8 Threads
1P
5M
2E
14 Threads
4P
8M
2E

Base Clock
3.3GHz
Base Clock
1.6GHz
Boost Clock
-
Boost Clock
4.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
64KB P
64KB M
64KB E
L1d
64KB P
64KB M
32KB E
L1d
48KB P
32KB M
32KB E
L2
1MB P
512KB M
128KB E
-
-
L2
2MB P
-
-
2MB M shared
2MB E shared
L3
12MB
L3
12MB
SLC Cache
4MB
SLC Cache
-

Type
LPDDR5X
Type
·
Max Memory
24GB
Max Memory
96GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
128-bit
Speed
9600MT/s
Speed
7466MT/s
Bandwidth
76.8GB/s
Bandwidth
119.5GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
119.5GB/s

TDP
5W
TDP
15W
cTDP-down
-
cTDP-down
12W
cTDP-up
-
cTDP-up
28W
Peak Power
-
Peak Power
57W
Max Operating Temp
-
Max Operating Temp
110°C Max

-
PCIe
PCIe 4.0 x20
39.4GB/sBandwidth

iGPU
iGPU
Shaders
1536
Shaders
512
Boost Clock
900MHz
Boost Clock
1.9GHz
··
5.53 TFLOPSFP16
··
3.89 TFLOPSFP16

NPU Model
Hexagon
NPU Model
AI Boost 3
NPU Cores
-
NPU Cores
2
NPU Clock
-
NPU Clock
1.4GHz
Performance
45 TOPSINT8
Performance
11.5 TOPSINT8

Modem Model
X75
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 10.0Gbps
Peak Down
-
Peak Up
Up to 3.5Gbps
Peak Up
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
KryoARMv9.0-A
Architecture
Family
Family
Branding
Snapdragon 8 Gen 3  branding
Branding
Core Ultra 5 2023 branding
Codename
-
Snapdragon 8 Gen 3Variant
Cortex-X4P-Core
Cortex-A720M-Core
Cortex-A520E-Core
Codename
Meteor Lake-U
Meteor Lake-P-2PVariant
Redwood CoveP-Core
CrestmontM-Core
CrestmontE-Core
Market Segment
Smartphone
Market Segment
Laptop
Release Date
Oct 24, 2023
Release Date
Dec 14, 2023

Foundry
TSMC
Foundry
Intel
Other Foundries
-
Other Foundries
TSMCiGPU
TSMCIO
TSMCSoC
Fabrication Node
N4P
-
-
-
Fabrication Node
Intel 4
N5iGPU
N6IO
N6SoC
Die Size
137mm²
-
-
-
Die Size
38mm²
23mm²iGPU
28mm²IO
100mm²SoC
Transistor Count
-
Transistor Count
5.5 Billion
Transistor Density
-
Transistor Density
147 MTr/mm²

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