Qualcomm Snapdragon 8 Gen 3 vs Intel Core Ultra 5 135U Full Specs
8 Cores(1P+5M+2E) 8 Threads(1P+5M+2E) 3.3GHz | 12 Cores(2P+8M+2E) 14 Threads(4P+8M+2E) 1.6GHz |
TDP 5W | TDP 15W |
Bandwidth 76.8GB/s LPDDR5X | Bandwidth 119.5GB/s · |
iGPU | iGPU |
·· 5.53 TFLOPSFP16 | ·· 3.89 TFLOPSFP16 |
Socket - | Socket |
8 Cores 1P 5M 2E | 12 Cores 2P 8M 2E |
8 Threads 1P 5M 2E | 14 Threads 4P 8M 2E |
Base Clock 3.3GHz | Base Clock 1.6GHz |
Boost Clock - | Boost Clock 4.4GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 64KB P 64KB M 64KB E |
L1d 64KB P 64KB M 32KB E | L1d 48KB P 32KB M 32KB E |
L2 1MB P 512KB M 128KB E - - | L2 2MB P - - 2MB M shared 2MB E shared |
L3 12MB | L3 12MB |
SLC Cache 4MB | SLC Cache - |
Type LPDDR5X | Type · |
Max Memory 24GB | Max Memory 96GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 64-bit | Bus Width 128-bit |
Speed 9600MT/s | Speed 7466MT/s |
Bandwidth 76.8GB/s | Bandwidth 119.5GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 76.8GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 119.5GB/s |
TDP 5W | TDP 15W |
cTDP-down - | cTDP-down 12W |
cTDP-up - | cTDP-up 28W |
Peak Power - | Peak Power 57W |
Max Operating Temp - | Max Operating Temp 110°C Max |
- | PCIe PCIe 4.0 x2039.4GB/sBandwidth |
iGPU | iGPU |
Shaders 1536 | Shaders 512 |
Boost Clock 900MHz | Boost Clock 1.9GHz |
·· 5.53 TFLOPSFP16 | ·· 3.89 TFLOPSFP16 |
NPU Model Hexagon | NPU Model AI Boost 3 |
NPU Cores - | NPU Cores 2 |
NPU Clock - | NPU Clock 1.4GHz |
Performance 45 TOPSINT8 | Performance 11.5 TOPSINT8 |
Modem Model X75 | Modem Model - |
Cellular 5G mmWave | Cellular - |
Peak Down Up to 10.0Gbps | Peak Down - |
Peak Up Up to 3.5Gbps | Peak Up - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture KryoARMv9.0-A | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename - Snapdragon 8 Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core | Codename Meteor Lake-U Meteor Lake-P-2PVariant Redwood CoveP-Core CrestmontM-Core CrestmontE-Core |
Market Segment Smartphone | Market Segment Laptop |
Release Date Oct 24, 2023 | Release Date Dec 14, 2023 |
Foundry TSMC | Foundry Intel |
Other Foundries - | Other Foundries TSMCiGPU TSMCIO TSMCSoC |
Fabrication Node N4P - - - | Fabrication Node Intel 4 N5iGPU N6IO N6SoC |
Die Size 137mm² - - - | Die Size 38mm² 23mm²iGPU 28mm²IO 100mm²SoC |
Transistor Count - | Transistor Count 5.5 Billion |
Transistor Density - | Transistor Density 147 MTr/mm² |
No images available
No images available
Smartphones | Smartphones - |
Tablets | Tablets |



