Qualcomm Snapdragon 845 vs Qualcomm Snapdragon 8 Gen 3 Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2.8GHz	8 Cores(1P+5M+2E) 8 Threads(1P+5M+2E) 3.3GHz
TDP 5W	TDP 5W
Bandwidth 29.9GB/s LPDDR4X	Bandwidth 76.8GB/s LPDDR5X
iGPU Adreno 630	iGPU Adreno 750
Peak·FP32·FP16 1.45 TFLOPSFP16	Peak·FP32·FP16 5.53 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 845493

x1

Snapdragon 8 Gen 32,128

x4.32

Show Top Score

Core Config

8 Cores 4P - 4E	8 Cores 1P 5M 2E
8 Threads 4P - 4E	8 Threads 1P 5M 2E

Clocks

Base Clock 2.8GHz	Base Clock 3.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P - 32KB E	L1i 64KB P 64KB M 32KB E
L1d 32KB P - 32KB E	L1d 64KB P 64KB M 32KB E
L2 256KB P - 128KB E	L2 1MB P 512KB M 128KB E
L3 2MB	L3 12MB
SLC Cache 3MB	SLC Cache 4MB

Memory

Type LPDDR4X	Type LPDDR5X
Max Memory 16GB	Max Memory 24GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 3733MT/s	Speed 9600MT/s
Bandwidth 29.9GB/s	Bandwidth 76.8GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 29.9GB/s	Bandwidth Calculator Channels Transfer Rate9600MT/s Calculated Bandwidth 76.8GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Adreno 630	iGPU Adreno 750
Shaders 512	Shaders 1536
Boost Clock 710MHz	Boost Clock 900MHz
Peak·FP32·FP16 1.45 TFLOPSFP16	Peak·FP32·FP16 5.53 TFLOPSFP16

NPU

NPU Model Hexagon 685	NPU Model Hexagon
Performance 3 TOPS	Performance 45 TOPSINT8

Cellular

Modem Model X20	Modem Model X75
Cellular LTE	Cellular 5G mmWave
Peak Down Up to 1.2Gbps	Peak Down Up to 10.0Gbps
Peak Up Up to 150Mbps	Peak Up Up to 3.5Gbps

Chip

Manufacturer Qualcomm	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Kryo 385ARMv8.2-A	Architecture KryoARMv9.0-A
Family 8 Series	Family 8 Series
Branding	Branding
Codename - Cortex-A75P-Core - Cortex-A55E-Core	Codename Snapdragon 8 Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Dec 6, 2017	Release Date Oct 24, 2023

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 10LPP	Fabrication Node N4P
Die Size -	Die Size 137mm²

Images

No images available

No images available

Used In

Smartphones Pixel 3Pixel 3 XL	Smartphones OnePlus 12OnePlus 13R
Tablets -	Tablets OnePlus Pad 2(SD 8G3, Mid 2024)

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