Qualcomm Snapdragon 855 vs MediaTek Dimensity 7200 Full Specs
8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.84GHz | 8 Cores(2P+6E) 8 Threads(2P+6E) 2.8GHz |
TDP 5W | TDP - |
Bandwidth 34.1GB/s LPDDR4X | Bandwidth 51.2GB/s · |
iGPU | iGPU |
·· 1.8 TFLOPSFP16 | ·· 1.16 TFLOPSFP16 |
Snapdragon 855901
Dimensity 72001,1878 Cores 1P 3M 4E | 8 Cores 2P - 6E |
8 Threads 1P 3M 4E | 8 Threads 2P - 6E |
Base Clock 2.84GHz | Base Clock 2.8GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 64KB P - 32KB E |
L1d 64KB P 64KB M 32KB E | L1d 64KB P - 32KB E |
L2 512KB P 256KB M 128KB E | L2 1MB P - 128KB E |
L3 2MB | L3 4MB |
SLC Cache 3MB | SLC Cache - |
Type LPDDR4X | Type · |
Max Memory 16GB | Max Memory - |
ECC No | ECC No |
Channels 4 | Channels 4 |
Bus Width 64-bit | Bus Width 64-bit |
Speed 4266MT/s | Speed 6400MT/s |
Bandwidth 34.1GB/s | Bandwidth 51.2GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 34.1GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 51.2GB/s |
TDP 5W | TDP - |
iGPU | iGPU |
Shaders 768 | Shaders 256 |
Boost Clock 585MHz | Boost Clock 1.13GHz |
·· 1.8 TFLOPSFP16 | ·· 1.16 TFLOPSFP16 |
NPU Model Hexagon 690 | NPU Model MediaTek APU 650 |
NPU Clock 576MHz | NPU Clock - |
Performance 7 TOPS | Performance - |
Modem Model X24 | Modem Model MT 5G R2 |
Cellular LTE | Cellular 5G |
Peak Down Up to 2.0Gbps | Peak Down Up to 4.7Gbps |
Peak Up Up to 316Mbps | Peak Up Up to 900Mbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture Kryo 485ARMv8.2-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename Snapdragon 855Variant Cortex-A76P-Core Cortex-A76M-Core Cortex-A55E-Core | Codename - Cortex-A715P-Core - Cortex-A510E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Oct 22, 2019 | Release Date Feb 1, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N7 | Fabrication Node N4P |
Die Size 77mm² | Die Size - |
No images available
No images available
Smartphones | Smartphones |