Qualcomm Snapdragon 855 vs Qualcomm Snapdragon 8 Gen 3 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.84GHz	8 Cores(1P+5M+2E) 8 Threads(1P+5M+2E) 3.3GHz
TDP 5W	TDP 5W
Bandwidth 34.1GB/s LPDDR4X	Bandwidth 76.8GB/s LPDDR5X
iGPU Adreno 640	iGPU Adreno 750
Peak·FP32·FP16 1.8 TFLOPSFP16	Peak·FP32·FP16 5.53 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 855901

x1

Snapdragon 8 Gen 32,128

x2.36

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Core Config

8 Cores 1P 3M 4E	8 Cores 1P 5M 2E
8 Threads 1P 3M 4E	8 Threads 1P 5M 2E

Clocks

Base Clock 2.84GHz	Base Clock 3.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 64KB P 64KB M 32KB E
L1d 64KB P 64KB M 32KB E	L1d 64KB P 64KB M 32KB E
L2 512KB P 256KB M 128KB E	L2 1MB P 512KB M 128KB E
L3 2MB	L3 12MB
SLC Cache 3MB	SLC Cache 4MB

Memory

Type LPDDR4X	Type LPDDR5X
Max Memory 16GB	Max Memory 24GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 4266MT/s	Speed 9600MT/s
Bandwidth 34.1GB/s	Bandwidth 76.8GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s	Bandwidth Calculator Channels Transfer Rate9600MT/s Calculated Bandwidth 76.8GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Adreno 640	iGPU Adreno 750
Shaders 768	Shaders 1536
Boost Clock 585MHz	Boost Clock 900MHz
Peak·FP32·FP16 1.8 TFLOPSFP16	Peak·FP32·FP16 5.53 TFLOPSFP16

NPU

NPU Model Hexagon 690	NPU Model Hexagon
NPU Clock 576MHz	NPU Clock -
Performance 7 TOPS	Performance 45 TOPSINT8

Cellular

Modem Model X24	Modem Model X75
Cellular LTE	Cellular 5G mmWave
Peak Down Up to 2.0Gbps	Peak Down Up to 10.0Gbps
Peak Up Up to 316Mbps	Peak Up Up to 3.5Gbps

Chip

Manufacturer Qualcomm	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Kryo 485ARMv8.2-A	Architecture KryoARMv9.0-A
Family 8 Series	Family 8 Series
Branding	Branding
Codename Snapdragon 855Variant Cortex-A76P-Core Cortex-A76M-Core Cortex-A55E-Core	Codename Snapdragon 8 Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Oct 22, 2019	Release Date Oct 24, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N7	Fabrication Node N4P
Die Size 77mm²	Die Size 137mm²

Images

No images available

No images available

Used In

Smartphones Pixel 4Pixel 4 XL	Smartphones OnePlus 12OnePlus 13R
Tablets -	Tablets OnePlus Pad 2(SD 8G3, Mid 2024)

Competitors

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