Qualcomm Snapdragon 860 vs Qualcomm Snapdragon 870 Full Specs
8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.96GHz | 8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.2GHz |
TDP 5W | TDP 5W |
Bandwidth 34.1GB/s LPDDR4X | Bandwidth 44GB/s · |
iGPU | iGPU |
·· 2.07 TFLOPSFP16 | ·· 2.06 TFLOPSFP16 |
8 Cores 1P 3M 4E | 8 Cores 1P 3M 4E |
8 Threads 1P 3M 4E | 8 Threads 1P 3M 4E |
Base Clock 2.96GHz | Base Clock 3.2GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 64KB P 64KB M 32KB E |
L1d 64KB P 64KB M 32KB E | L1d 64KB P 64KB M 32KB E |
L2 512KB P 256KB M 128KB E | L2 512KB P 256KB M 128KB E |
L3 2MB | L3 4MB |
SLC Cache 3MB | SLC Cache 3MB |
Type LPDDR4X | Type · |
Max Memory 16GB | Max Memory 24GB |
ECC No | ECC No |
Channels 4 | Channels 4 |
Bus Width 64-bit | Bus Width 64-bit |
Speed 4266MT/s | Speed 5500MT/s |
Bandwidth 34.1GB/s | Bandwidth 44GB/s |
Bandwidth Calculator Channels Transfer Rate ·· | Bandwidth Calculator Channels Transfer Rate ·· |
TDP 5W | TDP 5W |
iGPU | iGPU |
Shaders 768 | Shaders 768 |
Boost Clock 675MHz | Boost Clock 670MHz |
·· 2.07 TFLOPSFP16 | ·· 2.06 TFLOPSFP16 |
NPU Model Hexagon 690 | NPU Model Hexagon 698 |
NPU Clock 576MHz | NPU Clock 576MHz |
Performance 7 TOPS | Performance 15 TOPS |
Modem Model X50 | Modem Model X55 |
Cellular 5G mmWave | Cellular 5G mmWave |
Peak Down Up to 5.0Gbps | Peak Down Up to 7.5Gbps |
Peak Up Up to 210Mbps | Peak Up Up to 3.0Gbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture Kryo 485ARMv8.2-A | Architecture Kryo 585ARMv8.2-A |
Family | Family |
Branding  | Branding |
Codename Cortex-A76P-Core Cortex-A76M-Core Cortex-A55E-Core | Codename Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Mar 25, 2021 | Release Date Mar 25, 2021 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N7 | Fabrication Node N7P |
Die Size - | Die Size 84mm² |
Transistor Count - | Transistor Count 10.3 Billion |
Transistor Density - | Transistor Density 123 MTr/mm² |
