Qualcomm Snapdragon 865+ vs Apple A9 (Samsung) Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz	2 Cores 2 Threads 1.85GHz
TDP 5W	TDP 5W
Bandwidth 44GB/s LPDDR5·LPDDR4X	Bandwidth 25.6GB/s LPDDR4
iGPU Adreno 650+	iGPU PowerVR GT7600 A9
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 499.2 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 865+1,134

x1.76

A9 (Samsung)644

x1

Show Top Score

Core Config

8 Cores 1P 3M 4E	2 Cores 2P - -
8 Threads 1P 3M 4E	2 Threads 2P - -

Clocks

Base Clock 3.1GHz	Base Clock 1.85GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 64KB P - -
L1d 64KB P 64KB M 32KB E	L1d 64KB P - -
L2 512KB P 256KB M 128KB E -	L2 3MB P shared
L3 4MB	L3 4MB
SLC Cache 3MB	SLC Cache -

Memory

Type LPDDR5·LPDDR4X	Type LPDDR4
Max Memory 24GB	Max Memory 2GB
ECC No	ECC No
Channels 4	Channels 1
Bus Width 64-bit	Bus Width 64-bit
Speed 5500MT/s	Speed 3200MT/s
Bandwidth 44GB/s	Bandwidth 25.6GB/s
Bandwidth Calculator Channels Transfer Rate5500MT/s Calculated Bandwidth 44GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 25.6GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Adreno 650+	iGPU PowerVR GT7600 A9
Shaders 768	Shaders 192
Boost Clock 670MHz	Boost Clock 650MHz
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 499.2 GFLOPSFP16

NPU

NPU Model Hexagon 698	NPU Model -
NPU Clock 576MHz	NPU Clock -
Performance 15 TOPS	Performance -

Cellular

Modem Model X55	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 7.5Gbps	Peak Down -
Peak Up Up to 3.0Gbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture Kryo 585ARMv8.2-A	Architecture Apple Silicon 4ARMv8.0-A
Family 8 Series	Family A Series
Branding	Branding
Codename - - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core	Codename Maui A9 SamsungVariant TwisterP-Core - -
Market Segment Smartphone	Market Segment Smartphone
Release Date Aug 30, 2020	Release Date Sep 25, 2015

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N7P	Fabrication Node 14LPP
Die Size 84mm²	Die Size 96mm²
Transistor Count 10.3 Billion	Transistor Count 2.5 Billion
Transistor Density 123 MTr/mm²	Transistor Density 26 MTr/mm²

Images

No images available

No images available

Used In

Smartphones -	Smartphones iPhone 6SiPhone SE(Gen 1)
Tablets Galaxy Tab S7(SD 865+, Mid 2020)Galaxy Tab S7+(SD 865+, Mid 2020)	Tablets iPad 5(A9, Early 2017)

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