Qualcomm Snapdragon 865+ vs Intel Core i5-8250U Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz	4 Cores 8 Threads 1.6GHz
TDP 5W	TDP 15W
Bandwidth 44GB/s LPDDR5·LPDDR4X	Bandwidth 34.1GB/s DDR4·LPDDR3·DDR3L
iGPU Adreno 650+	iGPU UHD 620 1100MHz
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 422.4 GFLOPSFP16
Socket -	Socket BGA 1356

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 865+1,134

x1.01

Core i5-8250U1,124

x1

Show Top Score

Core Config

8 Cores 1P 3M 4E	4 Cores 4P - -
8 Threads 1P 3M 4E	8 Threads 8P - -

Clocks

Base Clock 3.1GHz	Base Clock 1.6GHz
Boost Clock -	Boost Clock 3.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 32KB P - -
L1d 64KB P 64KB M 32KB E	L1d 32KB P - -
L2 512KB P 256KB M 128KB E	L2 256KB P - -
L3 4MB	L3 6MB
SLC Cache 3MB	SLC Cache -

Memory

Type LPDDR5·LPDDR4X	Type DDR4·LPDDR3·DDR3L
Max Memory 24GB	Max Memory 32GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 5500MT/s	Speed 2133MT/s
Bandwidth 44GB/s	Bandwidth 34.1GB/s
Bandwidth Calculator Channels Transfer Rate5500MT/s Calculated Bandwidth 44GB/s	Bandwidth Calculator Channels Transfer Rate2133MT/s Calculated Bandwidth 34.1GB/s

Power & Thermals

TDP 5W	TDP 15W
cTDP-down -	cTDP-down 10W
cTDP-up -	cTDP-up 25W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 2GB/s

Expansion

-	PCIe PCIe 3.0 x12 11.8GB/sBandwidth

iGPU

iGPU Adreno 650+	iGPU UHD 620 1100MHz
Shaders 768	Shaders 192
Boost Clock 670MHz	Boost Clock 1.1GHz
Peak·FP32·FP16 2.06 TFLOPSFP16	Peak·FP32·FP16 422.4 GFLOPSFP16

NPU

NPU Model Hexagon 698	NPU Model -
NPU Clock 576MHz	NPU Clock -
Performance 15 TOPS	Performance -

Cellular

Modem Model X55	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 7.5Gbps	Peak Down -
Peak Up Up to 3.0Gbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Kryo 585ARMv8.2-A	Architecture Skylake
Family 8 Series	Family Core 8th Gen
Branding	Branding
Codename - - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core	Codename Kaby Lake-R Kaby Lake-R-4C-GT2Variant - - -
Market Segment Smartphone	Market Segment Laptop
Release Date Aug 30, 2020	Release Date Aug 21, 2017

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N7P	Fabrication Node 14nm+
Die Size 84mm²	Die Size 123mm²
Transistor Count 10.3 Billion	Transistor Count 2.1 Billion
Transistor Density 123 MTr/mm²	Transistor Density 17 MTr/mm²

Images

No images available

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Used In

Laptops -	Laptops Surface Laptop 2 13(Late 2018)Notebook 7 13(Early 2018)Notebook 7 15(Early 2018) Show 2 more
Tablets Galaxy Tab S7(SD 865+, Mid 2020)Galaxy Tab S7+(SD 865+, Mid 2020)	Tablets Surface Pro 6(Intel 8th Gen, Late 2018)

Competitors

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IntelCore i5-8250U vs CPU AMDRyzen 3 210 IntelCore i5-8250U vs CPU AMDRyzen 5 240 IntelCore i5-8250U vs CPU AMDRyzen 7 260 Show 12 more