Qualcomm Snapdragon 865+ vs Intel Core Ultra 5 135U Full Specs
8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz | 12 Cores(2P+8M+2E) 14 Threads(4P+8M+2E) 1.6GHz |
TDP 5W | TDP 15W |
Bandwidth 44GB/s · | Bandwidth 119.5GB/s · |
iGPU | iGPU |
·· 2.06 TFLOPSFP16 | ·· 3.89 TFLOPSFP16 |
Socket - | Socket |
Snapdragon 865+1,134
Core Ultra 5 135U2,1358 Cores 1P 3M 4E | 12 Cores 2P 8M 2E |
8 Threads 1P 3M 4E | 14 Threads 4P 8M 2E |
Base Clock 3.1GHz | Base Clock 1.6GHz |
Boost Clock - | Boost Clock 4.4GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 64KB P 64KB M 64KB E |
L1d 64KB P 64KB M 32KB E | L1d 48KB P 32KB M 32KB E |
L2 512KB P 256KB M 128KB E - - | L2 2MB P - - 2MB M shared 2MB E shared |
L3 4MB | L3 12MB |
SLC Cache 3MB | SLC Cache - |
Type · | Type · |
Max Memory 24GB | Max Memory 96GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 64-bit | Bus Width 128-bit |
Speed 5500MT/s | Speed 7466MT/s |
Bandwidth 44GB/s | Bandwidth 119.5GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 44GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 119.5GB/s |
TDP 5W | TDP 15W |
cTDP-down - | cTDP-down 12W |
cTDP-up - | cTDP-up 28W |
Peak Power - | Peak Power 57W |
Max Operating Temp - | Max Operating Temp 110°C Max |
- | PCIe PCIe 4.0 x2039.4GB/sBandwidth |
iGPU | iGPU |
Shaders 768 | Shaders 512 |
Boost Clock 670MHz | Boost Clock 1.9GHz |
·· 2.06 TFLOPSFP16 | ·· 3.89 TFLOPSFP16 |
NPU Model Hexagon 698 | NPU Model AI Boost 3 |
NPU Cores - | NPU Cores 2 |
NPU Clock 576MHz | NPU Clock 1.4GHz |
Performance 15 TOPS | Performance 11.5 TOPSINT8 |
Modem Model X55 | Modem Model - |
Cellular 5G mmWave | Cellular - |
Peak Down Up to 7.5Gbps | Peak Down - |
Peak Up Up to 3.0Gbps | Peak Up - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture Kryo 585ARMv8.2-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename - - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core | Codename Meteor Lake-U Meteor Lake-P-2PVariant Redwood CoveP-Core CrestmontM-Core CrestmontE-Core |
Market Segment Smartphone | Market Segment Laptop |
Release Date Aug 30, 2020 | Release Date Dec 14, 2023 |
Foundry TSMC | Foundry Intel |
Other Foundries - | Other Foundries TSMCiGPU TSMCIO TSMCSoC |
Fabrication Node N7P - - - | Fabrication Node Intel 4 N5iGPU N6IO N6SoC |
Die Size 84mm² - - - | Die Size 38mm² 23mm²iGPU 28mm²IO 100mm²SoC |
Transistor Count 10.3 Billion | Transistor Count 5.5 Billion |
Transistor Density 123 MTr/mm² | Transistor Density 147 MTr/mm² |
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