Qualcomm Snapdragon 865+ vs Intel Pentium Gold 4415Y Full Specs
8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz | 2 Cores 4 Threads 1.6GHz |
TDP 5W | TDP 6W |
Bandwidth 44GB/s · | Bandwidth 29.9GB/s · |
iGPU | iGPU |
·· 2.06 TFLOPSFP16 | ·· 326.4 GFLOPSFP16 |
Socket - | Socket |
Snapdragon 865+1,134
Pentium Gold 4415Y3608 Cores 1P 3M 4E | 2 Cores 2P - - |
8 Threads 1P 3M 4E | 4 Threads 4P - - |
Base Clock 3.1GHz | Base Clock 1.6GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 32KB P - - |
L1d 64KB P 64KB M 32KB E | L1d 32KB P - - |
L2 512KB P 256KB M 128KB E | L2 256KB P - - |
L3 4MB | L3 2MB |
SLC Cache 3MB | SLC Cache - |
Type · | Type · |
Max Memory 24GB | Max Memory 16GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 64-bit | Bus Width 128-bit |
Speed 5500MT/s | Speed 1866MT/s |
Bandwidth 44GB/s | Bandwidth 29.9GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 44GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 29.9GB/s |
TDP 5W | TDP 6W |
cTDP-down - | cTDP-down 5W |
Max Operating Temp - | Max Operating Temp 100°C Max |
Bus Type - | Bus Type OPI |
Bus Config - | Bus Config 4 lanes |
Bus Speed - | Bus Speed 4GT/s |
Bus Bandwidth - | Bus Bandwidth 2GB/s |
- | PCIe PCIe 3.0 x109.8GB/sBandwidth |
iGPU | iGPU |
Shaders 768 | Shaders 192 |
Boost Clock 670MHz | Boost Clock 850MHz |
·· 2.06 TFLOPSFP16 | ·· 326.4 GFLOPSFP16 |
NPU Model Hexagon 698 | NPU Model - |
NPU Clock 576MHz | NPU Clock - |
Performance 15 TOPS | Performance - |
Modem Model X55 | Modem Model - |
Cellular 5G mmWave | Cellular - |
Peak Down Up to 7.5Gbps | Peak Down - |
Peak Up Up to 3.0Gbps | Peak Up - |
Controller Model - | Controller Model 200 Series Y+ |
Codename - | Codename Kaby Lake |
PCIe - | PCIe - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture Kryo 585ARMv8.2-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename - - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core | Codename Kaby Lake-H Kaby Lake-2C-GT2Variant - - - |
Market Segment Smartphone | Market Segment Laptop |
Release Date Aug 30, 2020 | Release Date Jan 3, 2017 |
Foundry TSMC | Foundry Intel |
Other Foundries - | Other Foundries IntelPCH |
Fabrication Node N7P - | Fabrication Node 14nm+ 22nmPCH |
Die Size 84mm² - | Die Size 103mm² 50mm²PCH |
Transistor Count 10.3 Billion | Transistor Count 1.8 Billion |
Transistor Density 123 MTr/mm² | Transistor Density 17 MTr/mm² |
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