CPUs

Qualcomm Snapdragon 865+ vs Samsung Exynos 850 Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3.1GHz
8 Cores
8 Threads
2GHz
TDP
5W
TDP
5W
Bandwidth
44GB/s
·
Bandwidth
34.1GB/s
LPDDR4X
iGPU
iGPU
··
2.06 TFLOPSFP16
··
40.8 GFLOPSFP16

8 Cores
1P
3M
4E
8 Cores
8P
-
-
8 Threads
1P
3M
4E
8 Threads
8P
-
-

Base Clock
3.1GHz
Base Clock
2GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
-
L1d
64KB P
64KB M
32KB E
L1d
-
L2
512KB P
256KB M
128KB E
L2
-
L3
4MB
L3
-
SLC Cache
3MB
SLC Cache
-

Type
·
Type
LPDDR4X
Max Memory
24GB
Max Memory
-
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
5500MT/s
Speed
4266MT/s
Bandwidth
44GB/s
Bandwidth
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
44GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
34.1GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
768
Shaders
12
Boost Clock
670MHz
Boost Clock
850MHz
··
2.06 TFLOPSFP16
··
40.8 GFLOPSFP16

NPU Model
Hexagon 698
NPU Model
-
NPU Clock
576MHz
NPU Clock
-
Performance
15 TOPS
Performance
-

Modem Model
X55
Modem Model
Shannon 318
Cellular
5G mmWave
Cellular
LTE
Peak Down
Up to 7.5Gbps
Peak Down
Up to 300Mbps
Peak Up
Up to 3.0Gbps
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Kryo 585ARMv8.2-A
Architecture
Family
Family
-
Branding
Snapdragon 5G  branding
Branding
Exynos 850  branding
Codename
Cortex-A77P-Core
Cortex-A77M-Core
Cortex-A55E-Core
Codename
Cortex-A55P-Core
-
-
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Aug 30, 2020
Release Date
Apr 1, 2020

Foundry
TSMC
Foundry
-
Fabrication Node
N7P
Fabrication Node
-
Die Size
84mm²
Die Size
-
Transistor Count
10.3 Billion
Transistor Count
-
Transistor Density
123 MTr/mm²
Transistor Density
-