Qualcomm Snapdragon 8cx Gen 1 vs Intel Core Ultra 5 226V Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 2.84GHz | 8 Cores(4P+4E) 8 Threads(4P+4E) 4.5GHz |
TDP - | TDP 17W |
Bandwidth 68.3GB/s LPDDR4X | Bandwidth 136.5GB/s LPDDR5X |
iGPU | iGPU |
·· 3.69 TFLOPSFP16 | ·· 106.1 TFLOPSFP16 |
Socket - | Socket |
Snapdragon 8cx Gen 1-
Core Ultra 5 226V2,5438 Cores 4P 4E | 8 Cores 4P 4E |
8 Threads 4P 4E | 8 Threads 4P 4E |
Base Clock 2.84GHz | Base Clock 4.5GHz |
Overclocking Locked | Overclocking Locked |
L0i - | L0i 64KB |
L0d - | L0d 48KB |
L1i 64KB P 32KB E | L1i - 64KB E |
L1d 64KB P 32KB E | L1d 192KB P 32KB E |
L2 512KB P 128KB E - | L2 2.5MB P - 4MB E shared |
L3 2MB | L3 8MB |
SLC Cache 3MB | SLC Cache - |
Type LPDDR4X | Type LPDDR5X |
Max Memory 16GB | Max Memory 16GB |
ECC No | ECC No |
Channels 8 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 4266MT/s | Speed 8533MT/s |
Bandwidth 68.3GB/s | Bandwidth 136.5GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 68.3GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 136.5GB/s |
TDP - | TDP 17W |
cTDP-down - | cTDP-down 8W |
Peak Power - | Peak Power 37W |
Max Operating Temp - | Max Operating Temp 100°C Max |
- | PCIe PCIe 5.0 x415.8GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth |
iGPU | iGPU |
Shaders 1536 | Shaders 896 |
Boost Clock 600MHz | Boost Clock 1.85GHz |
·· 3.69 TFLOPSFP16 | ·· 106.1 TFLOPSFP16 |
NPU Model Hexagon 690 | NPU Model AI Boost 4 |
NPU Cores - | NPU Cores 5 |
Performance 9 TOPS | Performance 40 TOPSINT8 |
Modem Model X55 | Modem Model - |
Cellular 5G mmWave | Cellular - |
Peak Down Up to 7.5Gbps | Peak Down - |
Peak Up Up to 3.0Gbps | Peak Up - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture Kryo 495ARMv8.2-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename - - Snapdragon 8cx Gen 1Variant Cortex-A76P-Core Cortex-A55E-Core | Codename Lunar Lake-V 3Die Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Jul 9, 2019 | Release Date Sep 3, 2024 |
Foundry TSMC | Foundry TSMC |
Other Foundries - | Other Foundries IntelFIB TSMCIO |
Fabrication Node N7 - - | Fabrication Node N3B 22nmFIB N6IO |
Die Size - | Die Size 140mm² 46mm²IO |
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