Qualcomm Snapdragon S3 (MSM8660) vs Apple A19 Pro (Air) Full Specs

Summary

2 Cores 2 Threads 1.7GHz	6 Cores(2P+4E) 6 Threads(2P+4E) 4.26GHz
TDP 5W	TDP 5W
Bandwidth 2.7GB/s LPDDR2	Bandwidth 76.8GB/s LPDDR5X
iGPU Adreno 220	iGPU 5-Core A19 Pro
Peak·FP32·FP16 34.05 GFLOPSFP16	Peak·FP32·FP16 3.76 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon S3 (MSM8660)-

-

A19 Pro (Air)3,674

x1

Show Top Score

Core Config

2 Cores 2P -	6 Cores 2P 4E
2 Threads 2P -	6 Threads 2P 4E

Clocks

Base Clock 1.7GHz	Base Clock 4.26GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 32KB P -	L1d 128KB P 64KB E
L2 512KB P shared -	L2 16MB P shared 6MB E shared
SLC Cache -	SLC Cache 32MB

Memory

Type LPDDR2	Type LPDDR5X
Max Memory 4GB	Max Memory 12GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 32-bit	Bus Width 64-bit
Speed 666MT/s	Speed 9600MT/s
Bandwidth 2.7GB/s	Bandwidth 76.8GB/s
Bandwidth Calculator Channels Transfer Rate666MT/s Calculated Bandwidth 2.7GB/s	Bandwidth Calculator Channels Transfer Rate9600MT/s Calculated Bandwidth 76.8GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power -	Peak Power 12W

Expansion

-	PCIe PCIe 4.0 x5 9.8GB/sBandwidth

iGPU

iGPU Adreno 220	iGPU 5-Core A19 Pro
Shaders 32	Shaders 640
Boost Clock 266MHz	Boost Clock 1.47GHz
Peak·FP32·FP16 34.05 GFLOPSFP16	Peak·FP32·FP16 3.76 TFLOPSFP16

NPU

NPU Model Hexagon QDSP6	NPU Model H18 Apollo
NPU Cores -	NPU Cores 16
NPU Clock 400MHz	NPU Clock 2.17GHz
Performance -	Performance 35 TOPSINT8

Cellular

Modem Model Gobi 3000	Modem Model -
Peak Down Up to 14.4Mbps	Peak Down -
Peak Up Up to 5.8Mbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch32	ISA AArch64
Architecture ScorpionARMv7-A	Architecture Apple Silicon 15ARMv9.2-A
Family S3 Series	Family A Series
Branding	Branding
Codename - - Cortex-A9P-Core -	Codename Thera A19 ProVariant AS15PP-Core AS15EE-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 9, 2010	Release Date Sep 9, 2025

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 45nm	Fabrication Node N3P
Die Size -	Die Size 99mm²
Transistor Count -	Transistor Count 17 Billion
Transistor Density -	Transistor Density 172 MTr/mm²

Images

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Used In

Smartphones -

Smartphones iPhone Air

Competitors

QualcommSnapdragon S3 (MSM8660) vs CPU AppleA18 Pro (Neo) QualcommSnapdragon S3 (MSM8660) vs CPU AppleA19 (17e) QualcommSnapdragon S3 (MSM8660) vs CPU AppleA19 Pro Show 12 more

AppleA19 Pro (Air) vs CPU AppleA18 Pro (Neo) AppleA19 Pro (Air) vs CPU AppleA18 (16e) AppleA19 Pro (Air) vs CPU AppleA18 Show 12 more