Qualcomm Snapdragon X Plus (X1P-42-100) vs AMD Ryzen 7 250 Full Specs
8 Cores 8 Threads 3.2GHz | 8 Cores 16 Threads 3.3GHz |
TDP 23W | TDP 28W |
Bandwidth 135.2GB/s LPDDR5X | Bandwidth 120GB/s · |
iGPU | iGPU |
·· 3.41 TFLOPSFP16 | ·· 8.29 TFLOPSFP16 |
Socket - | Socket |
8 Cores | 8 Cores |
8 Threads | 16 Threads |
Base Clock 3.2GHz | Base Clock 3.3GHz |
Boost Clock 3.4GHz | Boost Clock 5.1GHz |
Overclocking Locked | Overclocking Locked |
L1i 192KB | L1i 32KB |
L1d 96KB | L1d 32KB |
L2 24MB shared | L2 1MB |
L3 - | L3 16MB |
SLC Cache 6MB | SLC Cache - |
Type LPDDR5X | Type · |
Max Memory 64GB | Max Memory 256GB |
ECC No | ECC No |
Channels 8 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 8448MT/s | Speed 7500MT/s |
Bandwidth 135.2GB/s | Bandwidth 120GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 135.2GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 120GB/s |
TDP 23W | TDP 28W |
cTDP-down - | cTDP-down 15W |
cTDP-up - | cTDP-up 30W |
Max Operating Temp - | Max Operating Temp 100°C Max |
Bus Type - | Bus Type PCIe |
Bus Config - | Bus Config 4 lanes |
Bus Speed - | Bus Speed 16GT/s |
Bus Bandwidth - | Bus Bandwidth 8GB/s |
PCIe PCIe 4.0 x1223.6GB/sBandwidth | PCIe PCIe 4.0 x2039.4GB/sBandwidth |
PCIe Secondary PCIe 3.0 x43.9GB/sBandwidth | - |
iGPU | iGPU |
Shaders 1024 | Shaders 768 |
Boost Clock 833MHz | Boost Clock 2.7GHz |
·· 3.41 TFLOPSFP16 | ·· 8.29 TFLOPSFP16 |
NPU Model Hexagon | NPU Model XDNA |
Performance 45 TOPSINT8 | Performance 16 TOPSINT4 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N4P | Fabrication Node N4 |
Die Size 170mm² | Die Size 178mm² |
Transistor Count - | Transistor Count 25 Billion |
Transistor Density - | Transistor Density 140 MTr/mm² |
No images available
No images available
Laptops | Laptops - |



