Qualcomm Snapdragon X Plus (X1P-42-100) vs AMD Ryzen AI 7 350 Full Specs
8 Cores 8 Threads 3.2GHz | 8 Cores(4P+4E) 16 Threads(8P+8E) 2GHz |
TDP 23W | TDP 28W |
Bandwidth 135.2GB/s LPDDR5X | Bandwidth 128GB/s · |
iGPU | iGPU |
·· 3.41 TFLOPSFP16 | ·· 4.61 TFLOPSFP16 |
Socket - | Socket |
Snapdragon X Plus (X1P-42-100)2,288
Ryzen AI 7 350-8 Cores 8P - | 8 Cores 4P 4E |
8 Threads 8P - | 16 Threads 8P 8E |
Base Clock 3.2GHz | Base Clock 2GHz |
Boost Clock 3.4GHz | Boost Clock 5GHz |
Overclocking Locked | Overclocking Locked |
L1i 192KB P | L1i 32KB P |
L1d 96KB P | L1d 48KB P |
L2 24MB P shared | L2 1MB P - |
L3 - | L3 16MB |
SLC Cache 6MB | SLC Cache - |
Type LPDDR5X | Type · |
Max Memory 64GB | Max Memory 256GB |
ECC No | ECC No |
Channels 8 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 8448MT/s | Speed 8000MT/s |
Bandwidth 135.2GB/s | Bandwidth 128GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 135.2GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 128GB/s |
TDP 23W | TDP 28W |
cTDP-down - | cTDP-down 15W |
cTDP-up - | cTDP-up 54W |
Max Operating Temp - | Max Operating Temp 100°C Max |
Included Cooler - | Included Cooler 0 |
Bus Type - | Bus Type PCIe |
Bus Config - | Bus Config 4 lanes |
Bus Speed - | Bus Speed 16GT/s |
Bus Bandwidth - | Bus Bandwidth 8GB/s |
PCIe PCIe 4.0 x1223.6GB/sBandwidth | PCIe PCIe 4.0 x1631.5GB/sBandwidth |
PCIe Secondary PCIe 3.0 x43.9GB/sBandwidth | - |
iGPU | iGPU |
Shaders 1024 | Shaders 384 |
Boost Clock 833MHz | Boost Clock 3GHz |
·· 3.41 TFLOPSFP16 | ·· 4.61 TFLOPSFP16 |
NPU Model Hexagon | NPU Model XDNA 2 |
NPU Cores - | NPU Cores 32 |
Performance 45 TOPSINT8 | Performance 50 TOPSINT8 |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture OryonARMv8.7-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core - | Codename Strix Point - Zen 5P-Core Zen 5cE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Sep 4, 2024 | Release Date Jan 6, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N4P | Fabrication Node N4P |
Die Size 170mm² | Die Size 233mm² |
Transistor Count - | Transistor Count 28 Billion |
Transistor Density - | Transistor Density 120 MTr/mm² |
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