Qualcomm Snapdragon X Plus (X1P-42-100) vs Apple M3 (8C10G) Full Specs

Summary

8 Cores 8 Threads 3.2GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 4.05GHz
TDP 23W	TDP 30W
Bandwidth 135.2GB/s LPDDR5X	Bandwidth 102.4GB/s LPDDR5
iGPU Adreno X1 1.7T	iGPU 10-Core M3
Peak·FP32·FP16 3.41 TFLOPSFP16	Peak·FP32·FP16 3.42 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon X Plus (X1P-42-100)2,288

x1

M3 (8C10G)3,138

x1.37

Show Top Score

Core Config

8 Cores 8P -	8 Cores 4P 4E
8 Threads 8P -	8 Threads 4P 4E

Clocks

Base Clock 3.2GHz	Base Clock 4.05GHz
Boost Clock 3.4GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P -	L1i 192KB P 128KB E
L1d 96KB P -	L1d 128KB P 64KB E
L2 24MB P shared -	L2 16MB P shared 4MB E shared
SLC Cache 6MB	SLC Cache 8MB

Memory

Type LPDDR5X	Type LPDDR5
Max Memory 64GB	Max Memory 24GB
ECC No	ECC No
Channels 8	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8448MT/s	Speed 6400MT/s
Bandwidth 135.2GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s

Power & Thermals

TDP 23W	TDP 30W
Max Operating Temp -	Max Operating Temp 100°C Max

Expansion

PCIe PCIe 4.0 x12 23.6GB/sBandwidth	PCIe PCIe 4.0 x6 11.8GB/sBandwidth
PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth	-

iGPU

iGPU Adreno X1 1.7T	iGPU 10-Core M3
Shaders 1024	Shaders 1280
Boost Clock 833MHz	Boost Clock 1.34GHz
Peak·FP32·FP16 3.41 TFLOPSFP16	Peak·FP32·FP16 3.42 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model H15 Themis
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.36GHz
Performance 45 TOPSINT8	Performance 18 TOPSFP16

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture OryonARMv8.7-A	Architecture Apple Silicon 13ARMv8.6-A
Family X Series	Family M Series
Branding	Branding
Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core -	Codename Ibiza M3Variant EverestP-Core Sawtooth E-Core
Market Segment Laptop	Market Segment Laptop
Release Date Sep 4, 2024	Release Date Oct 30, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N3B
Die Size 170mm²	Die Size 153mm²
Transistor Count -	Transistor Count 25 Billion
Transistor Density -	Transistor Density 164 MTr/mm²

Images

No images available

No images available

Used In

Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)	Laptops MacBook Pro 14(M3, Late 2023)
All-in-Ones -	All-in-Ones iMac 24(M3, Four Ports, Late 2023)

Competitors

QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen AI 7 350 QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen 9 270 Show 12 more

AppleM3 (8C10G) vs CPU AppleM4 (10C8G-FL) AppleM3 (8C10G) vs CPU AppleM4 (8C9G-FL) AppleM3 (8C10G) vs CPU AppleM5 (9C10G-FL) Show 12 more