Qualcomm Snapdragon X2 Elite Extreme (X2E-96-100) vs AMD Ryzen AI Max+ 395 Full Specs

Summary

18 Cores(12P+6E) 18 Threads(12P+6E) 4.4GHz	16 Cores 32 Threads 3GHz
TDP 80W	TDP 65W
Bandwidth 228.6GB/s LPDDR5X	Bandwidth 256GB/s LPDDR5X
iGPU Adreno X2-90 7.6T	iGPU Radeon 8060S
Peak·FP32·FP16 15.16 TFLOPSFP16	Peak·FP32·FP16 29.7 TFLOPSFP16
Socket -	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon X2 Elite Extreme (X2E-96-100)-

-

Ryzen AI Max+ 3952,984

x1

Show Top Score

Core Config

18 Cores 12P 6E	16 Cores 16P -
18 Threads 12P 6E	32 Threads 32P -

Clocks

Base Clock 4.4GHz	Base Clock 3GHz
Boost Clock 5GHz	Boost Clock 5.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P -
L1d 96KB P 64KB E	L1d 48KB P -
L2 36MB P shared 12MB E shared	L2 1MB P - -
L3 -	L3 64MB

Memory

Type LPDDR5X	Type LPDDR5X
Max Memory 192GB	Max Memory 128GB
ECC No	ECC No
Channels 12	Channels 4
Bus Width 192-bit	Bus Width 256-bit
Speed 9523MT/s	Speed 8000MT/s
Bandwidth 228.6GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate9523MT/s Calculated Bandwidth 228.6GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP 80W	TDP 65W
cTDP-down -	cTDP-down 45W
cTDP-up -	cTDP-up 120W
Max Operating Temp -	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type -	Bus Type PCIe
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 5.0 x12 47.3GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Adreno X2-90 7.6T	iGPU Radeon 8060S
Shaders 2048	Shaders 2560
Boost Clock 1.85GHz	Boost Clock 2.9GHz
Peak·FP32·FP16 15.16 TFLOPSFP16	Peak·FP32·FP16 29.7 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model XDNA 2
NPU Cores -	NPU Cores 32
Performance 80 TOPSINT8	Performance 50 TOPSINT8

Chip

Manufacturer Qualcomm	Manufacturer AMD
ISA AArch64	ISA x86-64
Architecture Oryon 3ARMv8.7-A	Architecture Zen 5
Family X Series	Family Ryzen AI 300
Branding	Branding
Codename Glymur - Pegasus-PP-Core Pegasus-EE-Core	Codename Strix Halo EldoraDie Zen 5P-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Sep 24, 2025	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries TSMCSoC
Fabrication Node N3E -	Fabrication Node N4X N5SoC
Die Size 288mm²	Die Size 141mm²
Transistor Count -	Transistor Count 16.6 Billion
Transistor Density -	Transistor Density 118 MTr/mm²

Images

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Used In

Desktops -

Desktops Framework Desktop(Early 2025)

Competitors

QualcommSnapdragon X2 Elite Extreme (X2E-96-100) vs CPU QualcommSnapdragon X2 Elite (X2E-88-100) QualcommSnapdragon X2 Elite Extreme (X2E-96-100) vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) QualcommSnapdragon X2 Elite Extreme (X2E-96-100) vs CPU IntelCore Ultra 7 265HX Show 12 more

AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max PRO 380 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 385 Show 12 more