CPUs

UNISOC T740 vs Qualcomm Snapdragon 690 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
1.8GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
2GHz
TDP
5W
TDP
5W
Bandwidth
14.9GB/s
·
Bandwidth
14.9GB/s
LPDDR4X
iGPU
iGPU
··
409.6 GFLOPSFP16
··
972.8 GFLOPSFP16

8 Cores
4P
4E
8 Cores
2P
6E
8 Threads
4P
4E
8 Threads
2P
6E

Base Clock
1.8GHz
Base Clock
2GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
32KB E
L1i
64KB P
32KB E
L1d
32KB P
32KB E
L1d
64KB P
32KB E
L2
512KB P
128KB E
L2
512KB P
128KB E
SLC Cache
-
SLC Cache
1MB

Type
·
Type
LPDDR4X
Max Memory
-
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
32-bit
Bus Width
32-bit
Speed
3733MT/s
Speed
3733MT/s
Bandwidth
14.9GB/s
Bandwidth
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
14.9GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
128
Shaders
256
Boost Clock
800MHz
Boost Clock
950MHz
··
409.6 GFLOPSFP16
··
972.8 GFLOPSFP16

NPU Model
VQ7
NPU Model
Hexagon 692
Performance
3.2 TOPS
Performance
5 TOPS

Modem Model
UNISOC LTE 15
Modem Model
X51
Cellular
LTE
Cellular
5G mmWave
Peak Down
Up to 800Mbps
Peak Down
Up to 2.5Gbps
Peak Up
Up to 150Mbps
Peak Up
Up to 900Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 560ARMv8.2-A
Family
-
Family
Branding
T740  branding
Branding
Snapdragon  branding
Codename
Cortex-A75P-Core
Cortex-A55E-Core
Codename
Cortex-A77P-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Feb 1, 2020
Release Date
Jun 17, 2020

Foundry
-
Foundry
Samsung
Fabrication Node
-
Fabrication Node
8LPP