CPUs

UNISOC Tiger T612 vs Qualcomm Snapdragon 8 Gen 3 Full Specs

8 Cores(2P+6E)
8 Threads(2P+6E)
1.8GHz
8 Cores(1P+5M+2E)
8 Threads(1P+5M+2E)
3.3GHz
TDP
5W
TDP
5W
Bandwidth
14.9GB/s
··
Bandwidth
76.8GB/s
LPDDR5X
iGPU
iGPU
··
83.2 GFLOPSFP16
··
5.53 TFLOPSFP16

Tiger T612Tiger T612-
-
Snapdragon 8 Gen 3Snapdragon 8 Gen 32,128
x1

8 Cores
2P
-
6E
8 Cores
1P
5M
2E
8 Threads
2P
-
6E
8 Threads
1P
5M
2E

Base Clock
1.8GHz
Base Clock
3.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
-
32KB E
L1i
64KB P
64KB M
32KB E
L1d
32KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L2
512KB P
-
128KB E
L2
1MB P
512KB M
128KB E
L3
-
L3
12MB
SLC Cache
-
SLC Cache
4MB

Type
··
Type
LPDDR5X
Max Memory
-
Max Memory
24GB
ECC
No
ECC
No
Channels
2
Channels
4
Bus Width
32-bit
Bus Width
64-bit
Speed
3733MT/s
Speed
9600MT/s
Bandwidth
14.9GB/s
Bandwidth
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
76.8GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
32
Shaders
1536
Boost Clock
650MHz
Boost Clock
900MHz
··
83.2 GFLOPSFP16
··
5.53 TFLOPSFP16

NPU Model
-
NPU Model
Hexagon
Performance
-
Performance
45 TOPSINT8

Modem Model
-
Modem Model
X75
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 10.0Gbps
Peak Up
-
Peak Up
Up to 3.5Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
KryoARMv9.0-A
Family
-
Family
Branding
T612  branding
Branding
Snapdragon 8 Gen 3  branding
Codename
-
Cortex-A75P-Core
-
Cortex-A55E-Core
Codename
Snapdragon 8 Gen 3Variant
Cortex-X4P-Core
Cortex-A720M-Core
Cortex-A520E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Feb 1, 2022
Release Date
Oct 24, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N4P
Die Size
-
Die Size
137mm²

No images available
No images available

Smartphones
-
Smartphones
Tablets
-
Tablets