UNISOC W377 vs Qualcomm Snapdragon 205 Full Specs

Summary

2 Cores 2 Threads 1.3GHz	2 Cores 2 Threads 1.1GHz
TDP -	TDP 5W
Bandwidth 5.3GB/s LPDDR3·LPDDR2	Bandwidth 3.1GB/s LPDDR2
iGPU Mali-T820 MP1 384MHz	iGPU Adreno 304
Peak·FP32·FP16 7.68 GFLOPSFP32	Peak·FP32·FP16 38.4 GFLOPSFP16

Core Config

2 Cores	2 Cores
2 Threads	2 Threads

Clocks

Base Clock 1.3GHz	Base Clock 1.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 16KB
L1d 32KB	L1d 16KB
L2 512KB	L2 512KB shared

Memory

Type LPDDR3·LPDDR2	Type LPDDR2
Max Memory -	Max Memory 4GB
ECC No	ECC No
Channels 2	Channels 1
Bus Width 32-bit	Bus Width 32-bit
Speed 1333MT/s	Speed 768MT/s
Bandwidth 5.3GB/s	Bandwidth 3.1GB/s
Bandwidth Calculator Channels Transfer Rate1333MT/s UC·Spec·OC 5.3GB/s	Bandwidth Calculator Channels Transfer Rate768MT/s UC·Spec·OC 3.1GB/s

Power & Thermals

TDP -

TDP 5W

iGPU

iGPU Mali-T820 MP1 384MHz	iGPU Adreno 304
Shaders 10	Shaders 24
Boost Clock 384MHz	Boost Clock 400MHz
Peak·FP32·FP16 7.68 GFLOPSFP32	Peak·FP32·FP16 38.4 GFLOPSFP16

NPU

NPU Model -

NPU Model Hexagon 536

Cellular

Modem Model UNISOC LTE 4	Modem Model X5
Peak Down Up to 150Mbps	Peak Down Up to 150Mbps
Peak Up Up to 50Mbps	Peak Up Up to 50Mbps

Chip

Manufacturer UNISOC	Manufacturer Qualcomm
ISA AArch64	ISA AArch32
Architecture ARMv8.0-A	Architecture ARMv7-A
Family -	Family 2 Series
Branding	Branding
Codename Cortex-A53P-Core	Codename Cortex-A7P-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Mar 1, 2023	Release Date Mar 20, 2017

Fabrication

Foundry -	Foundry Samsung
Fabrication Node -	Fabrication Node 45nm

Images

Competitors

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