GPUs

Intel Arc A730M vs NVIDIA GeForce RTX 3050 Laptop 80W Full Specs

3,072 Shaders
1.1GHz
2,048 Shaders
1.74GHz
12GB GDDR6336GB/s
4GB GDDR6192GB/s
··
6.76 TFLOPS
··
7.13 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
80W
TDP
80W

Clock Speed
···
Clock Speed
···
Peak OPS
216.3 TOPSINT4 Tensor
Peak OPS
228.1 TOPSINT4 Tensor Sparse
Tensor FP16-16
-
FP16-16 Tensor Sparse
-
Tensor FP16-32
54.07 TFLOPS
FP16-32 Tensor Sparse
-
Tensor FP16-16
28.51 TFLOPS
FP16-16 Tensor Sparse
57.02 TFLOPS
Tensor FP16-32
14.25 TFLOPS
FP16-32 Tensor Sparse
28.51 TFLOPS
BF16
-
Tensor BF16
54.07 TFLOPS
BF16 Tensor Sparse
-
BF16
7.13 TFLOPS
Tensor BF16
14.25 TFLOPS
BF16 Tensor Sparse
28.51 TFLOPS
Tensor TF32
-
Tensor TF32
7.13 TFLOPS
FP32
6.76 TFLOPS
FP32
7.13 TFLOPS
FP64
1.69 TFLOPS
FP64
111.4 GFLOPS
Tensor INT4
216.3 TOPS
Tensor INT4
114 TOPS
Tensor INT8
108.1 TOPS
Tensor INT8
57.02 TOPS
Ray
-
Ray
10.75 TOPS
Pixel Rate
105.6 GPixel/s
Pixel Rate
55.7 GPixel/s
Texture Rate
211.2 GTexel/s
Texture Rate
111.4 GTexel/s

Shaders
3,072 Shaders
Shaders
2,048 Shaders
TMUs
192 TMUs
TMUs
64 TMUs
ROPs
96 ROPs
ROPs
32 ROPs
Tensor Cores
384 T-Cores
Tensor Cores
64 T-Cores
RT Cores
24 RT-Cores
RT Cores
16 RT-Cores
EUs
384 EUs
SMs
16 SMs

Base Clock
300MHz
Base Clock
1.49GHz
Boost Clock
1.1GHz
Boost Clock
1.74GHz

L2 Cache
8MB shared
L2 Cache
2MB shared

12GB GDDR6
4GB GDDR6
Memory Bus
192-bit
Memory Bus
128-bit
Memory Speed
14GT/s
Memory Speed
12GT/s
Memory Bandwidth
336GB/s
Memory Bandwidth
192GB/s
ECC
No
ECC
No

TDP
80W
TDP
80W

Multi-Monitor
4
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

Encoder Model
Arc
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
AV1
Codec
AVC (H.264)
HEVC (H.265)
-

Decoder Model
Arc
Decoder Model
NVDEC 5
Codec
-
MPEG-2
-
JPEG
-
-
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
GeForce RTX 2018 branding
Codename
Xe HPG
Codename
NV177
Chip Variant
DG2-512
Chip Variant
GA107-140-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 28, 2022
Release Date
May 11, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N6
Fabrication Node
8N
Die Size
406mm²
Die Size
200mm²
Transistor Count
21.7 Billion
Transistor Count
8.7 Billion
Transistor Density
53.45 MTr/mm²
Transistor Density
43.5 MTr/mm²