GPUs

NVIDIA GeForce RTX 3050 Laptop 50W vs Intel Arc A730M Full Specs

2,048 Shaders
1.42GHz
3,072 Shaders
1.1GHz
4GB GDDR6192GB/s
12GB GDDR6336GB/s
··
5.8 TFLOPS
··
6.76 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
50W
TDP
80W

Clock Speed
···
Clock Speed
···
Peak OPS
185.7 TOPSINT4 Tensor Sparse
Peak OPS
216.3 TOPSINT4 Tensor
Tensor FP16-16
23.22 TFLOPS
FP16-16 Tensor Sparse
46.43 TFLOPS
Tensor FP16-32
11.61 TFLOPS
FP16-32 Tensor Sparse
23.22 TFLOPS
Tensor FP16-16
-
FP16-16 Tensor Sparse
-
Tensor FP16-32
54.07 TFLOPS
FP16-32 Tensor Sparse
-
BF16
5.8 TFLOPS
Tensor BF16
11.61 TFLOPS
BF16 Tensor Sparse
23.22 TFLOPS
BF16
-
Tensor BF16
54.07 TFLOPS
BF16 Tensor Sparse
-
Tensor TF32
5.8 TFLOPS
Tensor TF32
-
FP32
5.8 TFLOPS
FP32
6.76 TFLOPS
FP64
90.69 GFLOPS
FP64
1.69 TFLOPS
Tensor INT4
92.86 TOPS
Tensor INT4
216.3 TOPS
Tensor INT8
46.43 TOPS
Tensor INT8
108.1 TOPS
Ray
8.75 TOPS
Ray
-
Pixel Rate
45.3 GPixel/s
Pixel Rate
105.6 GPixel/s
Texture Rate
90.7 GTexel/s
Texture Rate
211.2 GTexel/s

Shaders
2,048 Shaders
Shaders
3,072 Shaders
TMUs
64 TMUs
TMUs
192 TMUs
ROPs
32 ROPs
ROPs
96 ROPs
Tensor Cores
64 T-Cores
Tensor Cores
384 T-Cores
RT Cores
16 RT-Cores
RT Cores
24 RT-Cores
SMs
16 SMs
EUs
384 EUs

Base Clock
1.19GHz
Base Clock
300MHz
Boost Clock
1.42GHz
Boost Clock
1.1GHz

L2 Cache
2MB shared
L2 Cache
8MB shared

4GB GDDR6
12GB GDDR6
Memory Bus
128-bit
Memory Bus
192-bit
Memory Speed
12GT/s
Memory Speed
14GT/s
Memory Bandwidth
192GB/s
Memory Bandwidth
336GB/s
ECC
No
ECC
No

TDP
50W
TDP
80W

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
-

Encoder Model
NVENC 7
Encoder Model
Arc
Codec
AVC (H.264)
HEVC (H.265)
-
Codec
AVC (H.264)
HEVC (H.265)
AV1

Decoder Model
NVDEC 5
Decoder Model
Arc
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
-
MPEG-2
-
JPEG
-
-
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce RTX 2018 branding
Branding
Arc branding
Codename
NV177
Codename
Xe HPG
Chip Variant
GA107-140-A1
Chip Variant
DG2-512
Market Segment
Laptop
Market Segment
Laptop
Release Date
May 11, 2021
Release Date
Jun 28, 2022

Foundry
Samsung
Foundry
TSMC
Fabrication Node
8N
Fabrication Node
N6
Die Size
200mm²
Die Size
406mm²
Transistor Count
8.7 Billion
Transistor Count
21.7 Billion
Transistor Density
43.5 MTr/mm²
Transistor Density
53.45 MTr/mm²