NVIDIA GeForce RTX 3050 Laptop 50W vs Intel Arc A730M Full Specs
2,048 Shaders 1.42GHz | 3,072 Shaders 1.1GHz |
4GB GDDR6192GB/s | 12GB GDDR6336GB/s |
·· 5.8 TFLOPS | ·· 6.76 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 50W | TDP 80W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 185.7 TOPSINT4 Tensor Sparse | Peak OPS 216.3 TOPSINT4 Tensor |
Tensor FP16-16 23.22 TFLOPSFP16-16 Tensor Sparse 46.43 TFLOPSTensor FP16-32 11.61 TFLOPSFP16-32 Tensor Sparse 23.22 TFLOPS | Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 54.07 TFLOPSFP16-32 Tensor Sparse - |
BF16 5.8 TFLOPSTensor BF16 11.61 TFLOPSBF16 Tensor Sparse 23.22 TFLOPS | BF16 -Tensor BF16 54.07 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 5.8 TFLOPS | Tensor TF32 - |
FP32 5.8 TFLOPS | FP32 6.76 TFLOPS |
FP64 90.69 GFLOPS | FP64 1.69 TFLOPS |
Tensor INT4 92.86 TOPS | Tensor INT4 216.3 TOPS |
Tensor INT8 46.43 TOPS | Tensor INT8 108.1 TOPS |
Ray 8.75 TOPS | Ray - |
Pixel Rate 45.3 GPixel/s | Pixel Rate 105.6 GPixel/s |
Texture Rate 90.7 GTexel/s | Texture Rate 211.2 GTexel/s |
Shaders 2,048 Shaders | Shaders 3,072 Shaders |
TMUs 64 TMUs | TMUs 192 TMUs |
ROPs 32 ROPs | ROPs 96 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores 384 T-Cores |
RT Cores 16 RT-Cores | RT Cores 24 RT-Cores |
SMs 16 SMs | EUs 384 EUs |
Base Clock 1.19GHz | Base Clock 300MHz |
Boost Clock 1.42GHz | Boost Clock 1.1GHz |
L2 Cache 2MB shared | L2 Cache 8MB shared |
4GB GDDR6 | 12GB GDDR6 |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 12GT/s | Memory Speed 14GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 336GB/s |
ECC No | ECC No |
TDP 50W | TDP 80W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
Encoder Model NVENC 7 | Encoder Model Arc |
Codec AVC (H.264) HEVC (H.265) - | Codec AVC (H.264) HEVC (H.265) AV1 |
Decoder Model NVDEC 5 | Decoder Model Arc |
Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 | Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename Xe HPG |
Chip Variant GA107-140-A1 | Chip Variant DG2-512 |
Market Segment Laptop | Market Segment Laptop |
Release Date May 11, 2021 | Release Date Jun 28, 2022 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N6 |
Die Size 200mm² | Die Size 406mm² |
Transistor Count 8.7 Billion | Transistor Count 21.7 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 53.45 MTr/mm² |

