Apple 10-Core M3 vs Intel Arc A370M Full Specs

Summary

1,280 Shaders 1.34GHz	1,024 Shaders 1.55GHz
Shared Memory102.4GB/sLPDDR5	4GB GDDR6112GB/s placeholder
Peak·FP32·FP16 3.42 TFLOPS	Peak·FP32·FP16 3.17 TFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 35W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

10-Core M33.42 TFLOPSFP16

x1

Arc A370M101.6 TOPSINT4 Tensor

x29.66

Show Top Score

Theoretical Performance

Clock Speed1338MHz UC·Boost·OC	Clock Speed1550MHz UC·Base·Boost·OC
Peak OPS 3.42 TFLOPSFP16	Peak OPS 101.6 TOPSINT4 Tensor
-	Tensor FP16-32 25.4 TFLOPS
-	Tensor BF16 25.4 TFLOPS
FP32 3.42 TFLOPS	FP32 3.17 TFLOPS
-	FP64 793.6 GFLOPS
Tensor INT4 -	Tensor INT4 101.6 TOPS
-	Tensor INT8 50.79 TOPS
Pixel Rate 53.5 GPixel/s	Pixel Rate 49.6 GPixel/s
Texture Rate 107 GTexel/s	Texture Rate 99.2 GTexel/s

Core Config

Shaders 1,280 Shaders	Shaders 1,024 Shaders
TMUs 80 TMUs	TMUs 64 TMUs
ROPs 40 ROPs	ROPs 32 ROPs
Tensor Cores -	Tensor Cores 128 T-Cores
RT Cores 10 RT-Cores	RT Cores 8 RT-Cores
EUs 160 EUs	EUs 128 EUs

Clocks

Base Clock -	Base Clock 300MHz
Boost Clock 1.34GHz	Boost Clock 1.55GHz

Cache

L2 Cache 2MB shared

L2 Cache 4.1MB shared

Memory

Shared MemoryLPDDR5	4GB GDDR6 placeholder
Memory Bus 128-bit	Memory Bus 64-bit
Memory Speed 6.4GT/s	Memory Speed 14GT/s
Memory Bandwidth 102.4GB/s	Memory Bandwidth 112GB/s
ECC No	ECC No

Power & Thermals

TDP Shared

TDP 35W

Video Output

Multi-Monitor 1

Multi-Monitor 4

Encoder

Encoder Model Apple Media Engine 3

Encoder Model Arc

Decoder

Decoder Model Apple Media Engine 3

Decoder Model Arc

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Apple	Manufacturer Intel
Chip Designer Apple	Chip Designer Intel
Architecture Apple Gen 6	Architecture Alchemist
Family M Series	Family Arc A
Branding	Branding
Codename G15G	Codename Xe HPG
Chip Variant -	Chip Variant DG2-128
Market Segment Laptop	Market Segment Laptop
Release Date Oct 30, 2023	Release Date Mar 30, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3B	Fabrication Node N6
Die Size 153mm²	Die Size 157mm²
Transistor Count 25 Billion	Transistor Count 7.2 Billion
Transistor Density 164 MTr/mm²	Transistor Density 45.86 MTr/mm²

Images

No images available

No images available

Used In

CPUs M3 (8C10G)	CPUs -
Laptops MacBook Pro 14(M3, Late 2023)	Laptops XPS 15(9530, Early 2023)Envy 16(Early 2022)
All-in-Ones iMac 24(M3, Four Ports, Late 2023)	All-in-Ones -

Competitors

Apple10-Core M3 vs GPU Apple10-Core M5 Apple10-Core M3 vs GPU Apple10-Core M5-FL Apple10-Core M3 vs GPU Apple8-Core M4-FL Show 12 more

IntelArc A370M vs GPU NVIDIAGeForce RTX 5050 Laptop 60W IntelArc A370M vs GPU NVIDIAGeForce RTX 5050 Laptop 80W IntelArc A370M vs GPU NVIDIAGeForce RTX 5050 Laptop 50W Show 12 more