GPUs

Apple 10-Core M3 vs Intel Arc A370M Full Specs

1,280 Shaders
1.34GHz
1,024 Shaders
1.55GHz
Shared Memory102.4GB/sLPDDR5
4GB GDDR6112GB/s
··
3.42 TFLOPS
··
3.17 TFLOPS
Form Factor
iGPU
Form Factor
Soldered
TDP
Shared
TDP
35W

10-Core M310-Core M33.42 TFLOPSFP16
x1
Arc A370MArc A370M101.6 TOPSINT4 Tensor
x29.66

Clock Speed
··
Clock Speed
···
Peak OPS
3.42 TFLOPSFP16
Peak OPS
101.6 TOPSINT4 Tensor
-
Tensor FP16-32
25.4 TFLOPS
-
Tensor BF16
25.4 TFLOPS
FP32
3.42 TFLOPS
FP32
3.17 TFLOPS
-
FP64
793.6 GFLOPS
Tensor INT4
-
Tensor INT4
101.6 TOPS
-
Tensor INT8
50.79 TOPS
Pixel Rate
53.5 GPixel/s
Pixel Rate
49.6 GPixel/s
Texture Rate
107 GTexel/s
Texture Rate
99.2 GTexel/s

Shaders
1,280 Shaders
Shaders
1,024 Shaders
TMUs
80 TMUs
TMUs
64 TMUs
ROPs
40 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
128 T-Cores
RT Cores
10 RT-Cores
RT Cores
8 RT-Cores
EUs
160 EUs
EUs
128 EUs

Base Clock
-
Base Clock
300MHz
Boost Clock
1.34GHz
Boost Clock
1.55GHz

L2 Cache
2MB shared
L2 Cache
4.1MB shared

Shared MemoryLPDDR5
4GB GDDR6
Memory Bus
128-bit
Memory Bus
64-bit
Memory Speed
6.4GT/s
Memory Speed
14GT/s
Memory Bandwidth
102.4GB/s
Memory Bandwidth
112GB/s
ECC
No
ECC
No

TDP
Shared
TDP
35W

Multi-Monitor
1
Multi-Monitor
4

Encoder Model
Apple Media Engine 3
Encoder Model
Arc

Decoder Model
Apple Media Engine 3
Decoder Model
Arc

Form Factor
iGPU
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M3 branding
Branding
Arc branding
Codename
G15G
Codename
Xe HPG
Chip Variant
-
Chip Variant
DG2-128
Market Segment
Laptop
Market Segment
Laptop
Release Date
Oct 30, 2023
Release Date
Mar 30, 2022

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3B
Fabrication Node
N6
Die Size
153mm²
Die Size
157mm²
Transistor Count
25 Billion
Transistor Count
7.2 Billion
Transistor Density
164 MTr/mm²
Transistor Density
45.86 MTr/mm²

No images available
No images available