Apple 10-Core M3 vs NVIDIA GeForce RTX 3050 Ti Laptop 80W Full Specs
1,280 Shaders 1.34GHz | 2,560 Shaders 1.7GHz |
Shared Memory102.4GB/sLPDDR5 | 4GB GDDR6192GB/s placeholder |
·· 3.42 TFLOPS | ·· 8.68 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 80W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 3.42 TFLOPSFP16 | Peak OPS 277.7 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 34.71 TFLOPSFP16-16 Tensor Sparse 69.43 TFLOPSTensor FP16-32 17.36 TFLOPSFP16-32 Tensor Sparse 34.71 TFLOPS |
- | BF16 8.68 TFLOPSTensor BF16 17.36 TFLOPSBF16 Tensor Sparse 34.71 TFLOPS |
Tensor TF32 - | Tensor TF32 8.68 TFLOPS |
FP32 3.42 TFLOPS | FP32 8.68 TFLOPS |
- | FP64 135.6 GFLOPS |
Tensor INT4 - | Tensor INT4 138.9 TOPS |
- | Tensor INT8 69.43 TOPS |
Ray - | Ray 13.09 TOPS |
Pixel Rate 53.5 GPixel/s | Pixel Rate 54.2 GPixel/s |
Texture Rate 107 GTexel/s | Texture Rate 135.6 GTexel/s |
Shaders 1,280 Shaders | Shaders 2,560 Shaders |
TMUs 80 TMUs | TMUs 80 TMUs |
ROPs 40 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 80 T-Cores |
RT Cores 10 RT-Cores | RT Cores 20 RT-Cores |
EUs 160 EUs | SMs 20 SMs |
Base Clock - | Base Clock 1.46GHz |
Boost Clock 1.34GHz | Boost Clock 1.7GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
Shared MemoryLPDDR5 | 4GB GDDR6 placeholder |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 6.4GT/s | Memory Speed 12GT/s |
Memory Bandwidth 102.4GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP Shared | TDP 80W |
Multi-Monitor 1 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Apple Media Engine 3 | Encoder Model NVENC 7 |
Decoder Model Apple Media Engine 3 | Decoder Model NVDEC 5 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename G15G | Codename NV177 |
Chip Variant - | Chip Variant GA107-140-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Oct 30, 2023 | Release Date May 11, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N3B | Fabrication Node 8N |
Die Size 153mm² | Die Size 200mm² |
Transistor Count 25 Billion | Transistor Count 8.7 Billion |
Transistor Density 164 MTr/mm² | Transistor Density 43.5 MTr/mm² |
No images available
No images available
CPUs | CPUs - |
Laptops | Laptops |
All-in-Ones | All-in-Ones - |



