Apple 10-Core M3 vs NVIDIA GeForce RTX 4060 Laptop 110W Full Specs
1,280 Shaders 1.34GHz | 3,072 Shaders 2.3GHz |
Shared Memory102.4GB/sLPDDR5 | 8GB GDDR6256GB/s placeholder |
·· 3.42 TFLOPS | ·· 14.13 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 110W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 3.42 TFLOPSFP16 | Peak OPS 452.2 TOPSINT4 Tensor Sparse |
- | Tensor FP8-16 113 TFLOPSFP8-16 Tensor Sparse 226.1 TFLOPSTensor FP8-32 56.52 TFLOPSFP8-32 Tensor Sparse 113 TFLOPS |
- | Tensor FP16-16 56.52 TFLOPSFP16-16 Tensor Sparse 113 TFLOPSTensor FP16-32 28.26 TFLOPSFP16-32 Tensor Sparse 56.52 TFLOPS |
- | BF16 14.13 TFLOPSTensor BF16 28.26 TFLOPSBF16 Tensor Sparse 56.52 TFLOPS |
Tensor TF32 - | Tensor TF32 14.13 TFLOPS |
FP32 3.42 TFLOPS | FP32 14.13 TFLOPS |
- | FP64 220.8 GFLOPS |
Tensor INT4 - | Tensor INT4 226.1 TOPS |
- | Tensor INT8 113 TOPS |
Ray - | Ray 32.66 TOPS |
Pixel Rate 53.5 GPixel/s | Pixel Rate 110.4 GPixel/s |
Texture Rate 107 GTexel/s | Texture Rate 220.8 GTexel/s |
Shaders 1,280 Shaders | Shaders 3,072 Shaders |
TMUs 80 TMUs | TMUs 96 TMUs |
ROPs 40 ROPs | ROPs 48 ROPs |
Tensor Cores - | Tensor Cores 96 T-Cores |
RT Cores 10 RT-Cores | RT Cores 24 RT-Cores |
EUs 160 EUs | SMs 24 SMs |
Base Clock - | Base Clock 2.15GHz |
Boost Clock 1.34GHz | Boost Clock 2.3GHz |
L2 Cache 2MB shared | L2 Cache 32.8MB shared |
Shared MemoryLPDDR5 | 8GB GDDR6 placeholder |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 6.4GT/s | Memory Speed 16GT/s |
Memory Bandwidth 102.4GB/s | Memory Bandwidth 256GB/s |
ECC No | ECC No |
TDP Shared | TDP 110W |
Multi-Monitor 1 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Apple Media Engine 3 | Encoder Model NVENC 8 |
Decoder Model Apple Media Engine 3 | Decoder Model NVDEC 5 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename G15G | Codename NV187 |
Chip Variant - | Chip Variant AD107 |
Market Segment Laptop | Market Segment Laptop |
Release Date Oct 30, 2023 | Release Date Feb 22, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N3B | Fabrication Node 4N |
Die Size 153mm² | Die Size 159mm² |
Transistor Count 25 Billion | Transistor Count 18.9 Billion |
Transistor Density 164 MTr/mm² | Transistor Density 118.9 MTr/mm² |
No images available
No images available
CPUs | CPUs - |
Laptops | Laptops |
All-in-Ones | All-in-Ones - |



