Apple 10-Core M4-FL vs Intel Arc 8C 2250MHz Full Specs

Summary

1,280 Shaders 1.58GHz	1,024 Shaders 2.25GHz
Shared Memory120GB/sLPDDR5X	Shared Memory119.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 4.04 TFLOPS	Peak·FP32·FP16 4.61 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth

10-Core M4-FL4.04 TFLOPSFP16

x1

Arc 8C 2250MHz9.22 TFLOPSFP16

x2.28

Show Top Score

Theoretical Performance

Clock Speed1578MHz UC·Boost·OC	Clock Speed2250MHz UC·Boost·OC
Peak OPS 4.04 TFLOPSFP16	Peak OPS 9.22 TFLOPSFP16
FP32 4.04 TFLOPS	FP32 4.61 TFLOPS
-	FP64 1.15 TFLOPS
Pixel Rate 63.1 GPixel/s	Pixel Rate 72 GPixel/s
Texture Rate 126.2 GTexel/s	Texture Rate 144 GTexel/s

Core Config

Shaders 1,280 Shaders	Shaders 1,024 Shaders
TMUs 80 TMUs	TMUs 64 TMUs
ROPs 40 ROPs	ROPs 32 ROPs
RT Cores 10 RT-Cores	RT Cores 8 RT-Cores
EUs 160 EUs	EUs 128 EUs

Clocks

Boost Clock 1.58GHz

Boost Clock 2.25GHz

Cache

L2 Cache 2MB shared

L2 Cache -

Memory

Shared MemoryLPDDR5X	Shared Memory LPDDR5X·DDR5
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 7.5GT/s	Memory Speed 7.5GT/s
Memory Bandwidth 120GB/s	Memory Bandwidth 119.5GB/s
ECC No	ECC No

Video Output

Max Resolution 7680x4320	Max Resolution 7680x4320
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz
Multi-Monitor 2	Multi-Monitor 4
DSC Supported	DSC Supported

API Support

Shader Model -	Shader Model 6.4
-	DirectX DirectX 12 Direct3D 12_1
-	OpenGL 4.6 OpenCL 3 Vulkan 1.2

Encoder

Encoder Apple Media Engine 3	Encoder Arc
Codec AVC (H.264) HEVC (H.265) - ProRes	Codec AVC (H.264) HEVC (H.265) AV1 -

Decoder

Decoder Apple Media Engine 3	Decoder Arc
Codec - - - AVC (H.264) HEVC (H.265) AV1 ProRes	Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1 -

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer Intel
Chip Designer Apple	Chip Designer Intel
Architecture Apple Gen 7	Architecture Alchemist
Family M Series	Family Gen 12
Branding	Branding
Codename G16G	Codename Xe LPG
Chip Variant -	Chip Variant GT1
Market Segment Tablet	Market Segment Laptop
Release Date May 7, 2024	Release Date Dec 14, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node N5
Die Size 169mm²	Die Size 23mm²
Transistor Count 28B	Transistor Count -
Transistor Density 165 MTr/mm²	Transistor Density -

Images