Apple 16-Core M4 Pro vs Intel Arc 8C 2250MHz Full Specs

Summary

2,048 Shaders 1.58GHz	1,024 Shaders 2.25GHz
Shared Memory273.1GB/sLPDDR5X	Shared Memory119.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 6.46 TFLOPS	Peak·FP32·FP16 4.61 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth

16-Core M4 Pro6.46 TFLOPSFP16

x1

Arc 8C 2250MHz9.22 TFLOPSFP16

x1.43

Show Top Score

Theoretical Performance

Clock Speed1578MHz UC·Boost·OC	Clock Speed2250MHz UC·Boost·OC
Peak OPS 6.46 TFLOPSFP16	Peak OPS 9.22 TFLOPSFP16
FP32 6.46 TFLOPS	FP32 4.61 TFLOPS
-	FP64 1.15 TFLOPS
Pixel Rate 101 GPixel/s	Pixel Rate 72 GPixel/s
Texture Rate 202 GTexel/s	Texture Rate 144 GTexel/s

Core Config

Shaders 2,048 Shaders	Shaders 1,024 Shaders
TMUs 128 TMUs	TMUs 64 TMUs
ROPs 64 ROPs	ROPs 32 ROPs
RT Cores 16 RT-Cores	RT Cores 8 RT-Cores
EUs 256 EUs	EUs 128 EUs

Clocks

Boost Clock 1.58GHz

Boost Clock 2.25GHz

Cache

L2 Cache 4MB shared

L2 Cache -

Memory

Shared MemoryLPDDR5X	Shared Memory LPDDR5X·DDR5
Memory Bus 256-bit	Memory Bus 128-bit
Memory Speed 8.5GT/s	Memory Speed 7.5GT/s
Memory Bandwidth 273.1GB/s	Memory Bandwidth 119.5GB/s
ECC No	ECC No

Video Output

Max Resolution 7680x4320	Max Resolution 7680x4320
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 120Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz
Multi-Monitor 3	Multi-Monitor 4
DSC Supported	DSC Supported

API Support

Shader Model -	Shader Model 6.4
-	DirectX DirectX 12 Direct3D 12_1
-	OpenGL 4.6 OpenCL 3 Vulkan 1.2

Encoder

Encoder Apple Media Engine 3	Encoder Arc
Codec AVC (H.264) HEVC (H.265) - ProRes	Codec AVC (H.264) HEVC (H.265) AV1 -

Decoder

Decoder Apple Media Engine 3	Decoder Arc
Codec - - - AVC (H.264) HEVC (H.265) AV1 ProRes	Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1 -

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer Intel
Chip Designer Apple	Chip Designer Intel
Architecture Apple Gen 7	Architecture Alchemist
Family M Series	Family Gen 12
Branding	Branding
Codename G16S	Codename Xe LPG
Chip Variant -	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Oct 29, 2024	Release Date Dec 14, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node N5
Die Size 325mm²	Die Size 23mm²
Transistor Count 55B	Transistor Count -
Transistor Density 169 MTr/mm²	Transistor Density -

Images