Apple 30-Core M2 Max vs NVIDIA GeForce RTX 3050 Ti Laptop 80W Full Specs
3,840 Shaders 1.4GHz | 2,560 Shaders 1.7GHz |
Shared Memory409.6GB/sLPDDR5 | 4GB GDDR6192GB/s placeholder |
·· 10.74 TFLOPS | ·· 8.68 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 80W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 10.74 TFLOPSFP16 | Peak OPS 277.7 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 34.71 TFLOPSFP16-16 Tensor Sparse 69.43 TFLOPSTensor FP16-32 17.36 TFLOPSFP16-32 Tensor Sparse 34.71 TFLOPS |
- | BF16 8.68 TFLOPSTensor BF16 17.36 TFLOPSBF16 Tensor Sparse 34.71 TFLOPS |
Tensor TF32 - | Tensor TF32 8.68 TFLOPS |
FP32 10.74 TFLOPS | FP32 8.68 TFLOPS |
- | FP64 135.6 GFLOPS |
Tensor INT4 - | Tensor INT4 138.9 TOPS |
- | Tensor INT8 69.43 TOPS |
Ray - | Ray 13.09 TOPS |
Pixel Rate 167.8 GPixel/s | Pixel Rate 54.2 GPixel/s |
Texture Rate 335.5 GTexel/s | Texture Rate 135.6 GTexel/s |
Shaders 3,840 Shaders | Shaders 2,560 Shaders |
TMUs 240 TMUs | TMUs 80 TMUs |
ROPs 120 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 80 T-Cores |
RT Cores - | RT Cores 20 RT-Cores |
EUs 480 EUs | SMs 20 SMs |
Base Clock - | Base Clock 1.46GHz |
Boost Clock 1.4GHz | Boost Clock 1.7GHz |
L2 Cache 8.2MB shared | L2 Cache 2MB shared |
Shared MemoryLPDDR5 | 4GB GDDR6 placeholder |
Memory Bus 512-bit | Memory Bus 128-bit |
Memory Speed 6.4GT/s | Memory Speed 12GT/s |
Memory Bandwidth 409.6GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP Shared | TDP 80W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model 2x Apple Media Engine 2 | Encoder Model NVENC 7 |
Decoder Model Apple Media Engine 2 | Decoder Model NVDEC 5 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename G14C | Codename NV177 |
Chip Variant - | Chip Variant GA107-140-A1 |
Market Segment Desktop | Market Segment Laptop |
Release Date Jan 17, 2023 | Release Date May 11, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N5P | Fabrication Node 8N |
Die Size 486mm² | Die Size 200mm² |
Transistor Count 67 Billion | Transistor Count 8.7 Billion |
Transistor Density 138 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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