Apple 4-Core A14+ vs ARM Mali-G57 MP6 820MHz Full Specs

Summary

256 Shaders 1.28GHz	192 Shaders 820MHz
Shared Memory34.1GB/sLPDDR4X	Shared Memory34.1GB/sLPDDR4X
Peak·FP32·FP16 654.3 GFLOPS	Peak·FP32·FP16 314.9 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed1278MHz UC·Boost·OC	Clock Speed820MHz UC·Boost·OC
Peak OPS 654.3 GFLOPSFP16	Peak OPS 629.8 GFLOPSFP16
FP32 654.3 GFLOPS	FP32 314.9 GFLOPS
Pixel Rate 10.2 GPixel/s	Pixel Rate 9.8 GPixel/s
Texture Rate 20.4 GTexel/s	Texture Rate 19.7 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 192 Shaders
TMUs 16 TMUs	TMUs 24 TMUs
ROPs 8 ROPs	ROPs 12 ROPs
EUs 32 EUs	EUs 6 EUs

Clocks

Boost Clock 1.28GHz

Boost Clock 820MHz

Cache

L2 Cache 384KB shared

L2 Cache -

Memory

Shared MemoryLPDDR4X	Shared MemoryLPDDR4X
Memory Bus 64-bit	Memory Bus 64-bit
Memory Speed 4.3GT/s	Memory Speed 4.3GT/s
Memory Bandwidth 34.1GB/s	Memory Bandwidth 34.1GB/s
ECC No	ECC No

Video Output

Multi-Monitor 1

Multi-Monitor -

Encoder

-	Encoder Model V77
Codec -	Codec JPEG VP8 VP9 AVC (H.264) HEVC (H.265)

Decoder

-	Decoder Model V77
Codec -	Codec JPEG VP8 VP9 AVC (H.264) HEVC (H.265)

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer ARM
Chip Designer Apple	Chip Designer ARM
Architecture Apple Gen 4	Architecture Valhall 1
Family A Series	Family Series 7
Branding	Branding
Codename G13P	Codename -
Market Segment Smartphone	Market Segment Smartphone
Release Date Oct 23, 2020	Release Date Feb 1, 2020

Fabrication

Foundry TSMC	Foundry -
Fabrication Node N5	Fabrication Node -
Die Size 88mm²	Die Size -
Transistor Count 11.8 Billion	Transistor Count -
Transistor Density 134 MTr/mm²	Transistor Density -

Images