Apple 4-Core A15 vs ARM Mali-G57 MP6 820MHz Full Specs

Summary

512 Shaders 1.34GHz	192 Shaders 820MHz
Shared Memory34.1GB/sLPDDR4X	Shared Memory34.1GB/sLPDDR4X
Peak·FP32·FP16 1.37 TFLOPS	Peak·FP32·FP16 314.9 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed1338MHz UC·Boost·OC	Clock Speed820MHz UC·Boost·OC
Peak OPS 1.37 TFLOPSFP16	Peak OPS 629.8 GFLOPSFP16
FP32 1.37 TFLOPS	FP32 314.9 GFLOPS
Pixel Rate 21.4 GPixel/s	Pixel Rate 9.8 GPixel/s
Texture Rate 42.8 GTexel/s	Texture Rate 19.7 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 192 Shaders
TMUs 32 TMUs	TMUs 24 TMUs
ROPs 16 ROPs	ROPs 12 ROPs
EUs 64 EUs	EUs 6 EUs

Clocks

Boost Clock 1.34GHz

Boost Clock 820MHz

Cache

L2 Cache 512KB shared

L2 Cache -

Memory

Shared MemoryLPDDR4X	Shared MemoryLPDDR4X
Memory Bus 64-bit	Memory Bus 64-bit
Memory Speed 4.3GT/s	Memory Speed 4.3GT/s
Memory Bandwidth 34.1GB/s	Memory Bandwidth 34.1GB/s
ECC No	ECC No

Video Output

Multi-Monitor 1

Multi-Monitor -

Encoder

-	Encoder Model V77
Codec -	Codec JPEG VP8 VP9 AVC (H.264) HEVC (H.265)

Decoder

-	Decoder Model V77
Codec -	Codec JPEG VP8 VP9 AVC (H.264) HEVC (H.265)

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer ARM
Chip Designer Apple	Chip Designer ARM
Architecture Apple Gen 5	Architecture Valhall 1
Family A Series	Family Series 7
Branding	Branding
Codename G14P	Codename -
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 24, 2021	Release Date Feb 1, 2020

Fabrication

Foundry TSMC	Foundry -
Fabrication Node N5P	Fabrication Node -
Die Size 108mm²	Die Size -
Transistor Count 15 Billion	Transistor Count -
Transistor Density 139 MTr/mm²	Transistor Density -

Images