Apple 5-Core A18 Pro vs ARM Mali-G71 MP1 1200MHz Full Specs

Summary

640 Shaders 1.47GHz	12 Shaders 1.2GHz
Shared Memory60GB/sLPDDR5X	Shared Memory7.5GB/sLPDDR3
Peak·FP32·FP16 1.88 TFLOPS	Peak·FP32·FP16 28.8 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed1470MHz UC·Boost·OC	Clock Speed1200MHz UC·Boost·OC
Peak OPS 1.88 TFLOPSFP16	Peak OPS 57.6 GFLOPSFP16
FP32 1.88 TFLOPS	FP32 28.8 GFLOPS
Pixel Rate 29.4 GPixel/s	Pixel Rate 1.2 GPixel/s
Texture Rate 58.8 GTexel/s	Texture Rate 1.2 GTexel/s

Core Config

Shaders 640 Shaders	Shaders 12 Shaders
TMUs 40 TMUs	TMUs 1 TMU
ROPs 20 ROPs	ROPs 1 ROP
RT Cores 5 RT-Cores	RT Cores -
EUs 80 EUs	EUs 3 EUs

Clocks

Boost Clock 1.47GHz

Boost Clock 1.2GHz

Cache

L2 Cache 768KB shared

L2 Cache -

Memory

Shared MemoryLPDDR5X	Shared MemoryLPDDR3
Memory Bus 64-bit	Memory Bus 32-bit
Memory Speed 7.5GT/s	Memory Speed 1.9GT/s
Memory Bandwidth 60GB/s	Memory Bandwidth 7.5GB/s
ECC No	ECC No

Video Output

Multi-Monitor 1

Multi-Monitor -

Encoder

Encoder Model Apple Media Engine 3	-
Codec AVC (H.264) HEVC (H.265) ProRes	Codec -

Decoder

Decoder Model Apple Media Engine 3	-
Codec AVC (H.264) HEVC (H.265) AV1 ProRes	Codec -

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer ARM
Chip Designer Apple	Chip Designer ARM
Architecture Apple Gen 7	Architecture Bifrost 1
Family A Series	Family Series 1
Branding	Branding
Codename G17P	Codename -
Market Segment Smartphone	Market Segment Smartphone
Release Date Mar 4, 2026	Release Date Jan 1, 2018

Fabrication

Foundry TSMC	Foundry -
Fabrication Node N3E	Fabrication Node -
Die Size 110mm²	Die Size -
Transistor Count 18.4 Billion	Transistor Count -
Transistor Density 168 MTr/mm²	Transistor Density -

Images