Apple 5-Core A18 Pro vs Intel Arc 8C 2200MHz Full Specs

Summary

640 Shaders 1.47GHz	1,024 Shaders 2.2GHz
Shared Memory60GB/sLPDDR5X	Shared Memory119.5GB/s LPDDR5X·DDR5
Peak·FP32·FP16 1.88 TFLOPS	Peak·FP32·FP16 4.51 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth

5-Core A18 Pro1.88 TFLOPSFP16

x1

Arc 8C 2200MHz9.01 TFLOPSFP16

x4.79

Show Top Score

Theoretical Performance

Clock Speed1470MHz UC·Boost·OC	Clock Speed2200MHz UC·Boost·OC
Peak OPS 1.88 TFLOPSFP16	Peak OPS 9.01 TFLOPSFP16
FP32 1.88 TFLOPS	FP32 4.51 TFLOPS
-	FP64 1.13 TFLOPS
Pixel Rate 29.4 GPixel/s	Pixel Rate 70.4 GPixel/s
Texture Rate 58.8 GTexel/s	Texture Rate 140.8 GTexel/s

Core Config

Shaders 640 Shaders	Shaders 1,024 Shaders
TMUs 40 TMUs	TMUs 64 TMUs
ROPs 20 ROPs	ROPs 32 ROPs
RT Cores 5 RT-Cores	RT Cores 8 RT-Cores
EUs 80 EUs	EUs 128 EUs

Clocks

Boost Clock 1.47GHz

Boost Clock 2.2GHz

Cache

L2 Cache 768KB shared

L2 Cache -

Memory

Shared MemoryLPDDR5X	Shared Memory LPDDR5X·DDR5
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 7.5GT/s	Memory Speed 7.5GT/s
Memory Bandwidth 60GB/s	Memory Bandwidth 119.5GB/s
ECC No	ECC No

Video Output

Max Resolution 3840x2160	Max Resolution 7680x4320
Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz
Multi-Monitor 1	Multi-Monitor 4
DSC Not Supported	DSC Supported

API Support

Shader Model -	Shader Model 6.4
-	DirectX DirectX 12 Direct3D 12_1
-	OpenGL 4.6 OpenCL 3 Vulkan 1.2

Encoder

Encoder Apple Media Engine 3	Encoder Arc
Codec AVC (H.264) HEVC (H.265) - ProRes	Codec AVC (H.264) HEVC (H.265) AV1 -

Decoder

Decoder Apple Media Engine 3	Decoder Arc
Codec - - - AVC (H.264) HEVC (H.265) AV1 ProRes	Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1 -

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer Intel
Chip Designer Apple	Chip Designer Intel
Architecture Apple Gen 7	Architecture Alchemist
Family A Series	Family Gen 12
Branding	Branding
Codename G17P	Codename Xe LPG
Chip Variant -	Chip Variant GT1
Market Segment Smartphone	Market Segment Laptop
Release Date Mar 4, 2026	Release Date Dec 14, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node N5
Die Size 110mm²	Die Size 23mm²
Transistor Count 18.4B	Transistor Count -
Transistor Density 168 MTr/mm²	Transistor Density -

Images