Apple 5-Core A18 vs Imagination PowerVR MBX Lite A1 Full Specs

Summary

640 Shaders 1.34GHz	1 Shader 103MHz
Shared Memory60GB/sLPDDR5X	Shared Memory500MB/sLPDDR
Peak·FP32·FP16 1.71 TFLOPS	Peak·FP32·FP16 210 MFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed1338MHz UC·Boost·OC	Clock Speed103MHz UC·Boost·OC
Peak OPS 1.71 TFLOPSFP16	Peak OPS 210 MFLOPSFP32
FP32 1.71 TFLOPS	FP32 210 MFLOPS
Pixel Rate 26.8 GPixel/s	Pixel Rate 0.1 GPixel/s
Texture Rate 53.5 GTexel/s	Texture Rate 0.1 GTexel/s

Core Config

Shaders 640 Shaders	Shaders 1 Shader
TMUs 40 TMUs	TMUs 1 TMU
ROPs 20 ROPs	ROPs 1 ROP
RT Cores 5 RT-Cores	RT Cores -
EUs 80 EUs	EU 1 EU

Clocks

Boost Clock 1.34GHz

Boost Clock 103MHz

Cache

L2 Cache 768KB shared

L2 Cache -

Memory

Shared MemoryLPDDR5X	Shared MemoryLPDDR
Memory Bus 64-bit	Memory Bus 16-bit
Memory Speed 7.5GT/s	Memory Speed 266MT/s
Memory Bandwidth 60GB/s	Memory Bandwidth 500MB/s
ECC No	ECC No

Video Output

Multi-Monitor 1

Multi-Monitor 1

Encoder

Encoder Model Apple Media Engine 3	-
Codec AVC (H.264) HEVC (H.265) ProRes	Codec -

Decoder

Decoder Model Apple Media Engine 3	-
Codec AVC (H.264) HEVC (H.265) AV1 ProRes	Codec -

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer Imagination
Chip Designer Apple	Chip Designer Imagination
Architecture Apple Gen 7	Architecture MBX
Family A Series	Family A Series
Branding	Branding
Codename G17A	Codename Series4
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 9, 2024	Release Date Jun 29, 2007

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3E	Fabrication Node 90nm
Die Size 90mm²	Die Size 72mm²
Transistor Count 15.5 Billion	Transistor Count -
Transistor Density 172 MTr/mm²	Transistor Density -

Images