Apple 6-Core A17 Pro vs Imagination PowerVR SGX543 MP2 A5 Full Specs

Summary

768 Shaders 1.34GHz	32 Shaders 266MHz
Shared Memory51.2GB/sLPDDR5	Shared Memory6.4GB/sLPDDR2
Peak·FP32·FP16 2.06 TFLOPS	Peak·FP32·FP16 17.02 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Memory Bandwidth

6-Core A17 Pro2.06 TFLOPSFP16

x120.72

PowerVR SGX543 MP2 A517.02 GFLOPSFP32

x1

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Theoretical Performance

Clock Speed1338MHz UC·Boost·OC	Clock Speed266MHz UC·Boost·OC
Peak OPS 2.06 TFLOPSFP16	Peak OPS 17.02 GFLOPSFP32
FP32 2.06 TFLOPS	FP32 17.02 GFLOPS
Pixel Rate 32.1 GPixel/s	Pixel Rate 1.1 GPixel/s
Texture Rate 64.2 GTexel/s	Texture Rate 1.1 GTexel/s

Core Config

Shaders 768 Shaders	Shaders 32 Shaders
TMUs 48 TMUs	TMUs 4 TMUs
ROPs 24 ROPs	ROPs 4 ROPs
RT Cores 6 RT-Cores	RT Cores -
EUs 96 EUs	EUs 8 EUs

Clocks

Boost Clock 1.34GHz

Boost Clock 266MHz

Cache

L2 Cache 768KB shared

L2 Cache -

Memory

Shared MemoryLPDDR5	Shared MemoryLPDDR2
Memory Bus 64-bit	Memory Bus 64-bit
Memory Speed 6.4GT/s	Memory Speed 800MT/s
Memory Bandwidth 51.2GB/s	Memory Bandwidth 6.4GB/s
ECC No	ECC No

Video Output

Max Resolution 3840x2160	Max Resolution 1920x1080
Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz	Refresh Rate Calculator 1920x1080 Resolution1080p FHD Refresh Rate 60Hz
Multi-Monitor 1	Multi-Monitor 1
DSC Not Supported	DSC Not Supported

API Support

Shader Model -	Shader Model 3
-	DirectX DirectX 9 Direct3D 9_3
-	OpenGL 2

Encoder

Encoder Apple Media Engine 3	-
Codec AVC (H.264) HEVC (H.265) ProRes	Codec -

Decoder

Decoder Apple Media Engine 3	-
Codec AVC (H.264) HEVC (H.265) AV1 ProRes	Codec -

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer Imagination
Chip Designer Apple	Chip Designer Imagination
Architecture Apple Gen 6	Architecture SGX
Family A Series	Family A Series
Branding	Branding
Codename G16P	Codename Series5XT
Chip Variant -	Chip Variant SGX543
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 12, 2023	Release Date Oct 14, 2011

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3B	Fabrication Node 32nm
Die Size 104mm²	Die Size 38mm²
Transistor Count 19B	Transistor Count -
Transistor Density 183 MTr/mm²	Transistor Density -

Images