Apple 60-Core M2 Ultra vs NVIDIA GeForce RTX 3050 Full Specs
7,680 Shaders 1.4GHz | 2,560 Shaders 1.78GHz |
Shared Memory819.2GB/sLPDDR5 | 8GB GDDR6224GB/s placeholder |
·· 21.47 TFLOPS | ·· 9.1 TFLOPS |
Form Factor iGPU | Form Factor PCIe Card |
TDP Shared | TDP 115W |
Power Connectors - | Power Connectors 1x 12-Pin |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 21.47 TFLOPSFP16 | Peak OPS 291.1 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 36.39 TFLOPSFP16-16 Tensor Sparse 72.79 TFLOPSTensor FP16-32 18.2 TFLOPSFP16-32 Tensor Sparse 36.39 TFLOPS |
- | BF16 9.1 TFLOPSTensor BF16 18.2 TFLOPSBF16 Tensor Sparse 36.39 TFLOPS |
Tensor TF32 - | Tensor TF32 9.1 TFLOPS |
FP32 21.47 TFLOPS | FP32 9.1 TFLOPS |
- | FP64 142.2 GFLOPS |
Tensor INT4 - | Tensor INT4 145.6 TOPS |
- | Tensor INT8 72.79 TOPS |
Ray - | Ray 13.72 TOPS |
Pixel Rate 335.5 GPixel/s | Pixel Rate 56.9 GPixel/s |
Texture Rate 671 GTexel/s | Texture Rate 142.2 GTexel/s |
Shaders 7,680 Shaders | Shaders 2,560 Shaders |
TMUs 480 TMUs | TMUs 80 TMUs |
ROPs 240 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 80 T-Cores |
RT Cores - | RT Cores 20 RT-Cores |
EUs 960 EUs | SMs 20 SMs |
Base Clock - | Base Clock 1.55GHz |
Boost Clock 1.4GHz | Boost Clock 1.78GHz |
L2 Cache 16.4MB shared | L2 Cache 2MB shared |
Shared MemoryLPDDR5 | 8GB GDDR6 placeholder |
Memory Bus 1024-bit | Memory Bus 128-bit |
Memory Speed 6.4GT/s | Memory Speed 14GT/s |
Memory Bandwidth 819.2GB/s | Memory Bandwidth 224GB/s |
ECC No | ECC No |
TDP Shared | TDP 115W |
Multi-Monitor 8 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.4 |
- | 1x HDMI 2.1 |
Encoder Model 4x Apple Media Engine 2 | Encoder Model NVENC 7 |
Decoder Model 2x Apple Media Engine 2 | Decoder Model NVDEC 5 |
Form Factor iGPU | Form Factor PCIe Card |
PCIe - | PCIe 1.9-Slots |
- | Height 112 mm (4.41")Width 242 mm (9.53")Depth 38 mm (1.5") |
Cooling Passive - | Cooling Open-Air 2x Fans |
Power Connectors - | Power Connectors 1x 12-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename G14D | Codename NV177 |
Chip Variant - | Chip Variant GA107-140-A1 |
Market Segment Workstation | Market Segment Desktop |
Release Date Jun 5, 2023 | Release Date Dec 16, 2022 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N5P | Fabrication Node 8N |
Die Size 971mm² | Die Size 200mm² |
Transistor Count 134 Billion | Transistor Count 8.7 Billion |
Transistor Density 138 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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