GPUs

Apple 9-Core M3-FL vs Intel UHD 32EU 850MHz Gen 11 Full Specs

1,152 Shaders
1.34GHz
256 Shaders
850MHz
Shared Memory102.4GB/sLPDDR5
Shared Memory59.7GB/s
··
··
3.08 TFLOPS
··
435.2 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

9-Core M3-FL9-Core M3-FL3.08 TFLOPSFP16
x3.54
UHD 32EU 850MHz Gen 11UHD 32EU 850MHz Gen 11870.4 GFLOPSFP16
x1

Clock Speed
··
Clock Speed
···
Peak OPS
3.08 TFLOPSFP16
Peak OPS
870.4 GFLOPSFP16
FP32
3.08 TFLOPS
FP32
435.2 GFLOPS
-
FP64
108.8 GFLOPS
Pixel Rate
48.2 GPixel/s
Pixel Rate
6.8 GPixel/s
Texture Rate
96.3 GTexel/s
Texture Rate
13.6 GTexel/s

Shaders
1,152 Shaders
Shaders
256 Shaders
TMUs
72 TMUs
TMUs
16 TMUs
ROPs
36 ROPs
ROPs
8 ROPs
RT Cores
9 RT-Cores
RT Cores
-
EUs
144 EUs
EUs
32 EUs

Base Clock
-
Base Clock
300MHz
Boost Clock
1.34GHz
Boost Clock
850MHz

L2 Cache
2MB shared
L2 Cache
-

Shared MemoryLPDDR5
Shared Memory
··
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
6.4GT/s
Memory Speed
3.7GT/s
Memory Bandwidth
102.4GB/s
Memory Bandwidth
59.7GB/s
ECC
No
ECC
No

Multi-Monitor
1
Multi-Monitor
4

Encoder Model
Apple Media Engine 3
Encoder Model
Quick Sync Video 7

Decoder Model
Apple Media Engine 3
Decoder Model
Quick Sync Video 7

Form Factor
iGPU
Form Factor
iGPU
Cooling
Open-Air
Cooling
Passive

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M3 branding
Branding
UHD 2020 branding
Codename
G15G
Codename
-
Chip Variant
-
Chip Variant
GT1
Market Segment
Tablet
Market Segment
Desktop
Release Date
Mar 4, 2025
Release Date
Jan 11, 2021

Foundry
TSMC
Foundry
Intel
Fabrication Node
N3B
Fabrication Node
10nm+
Die Size
153mm²
Die Size
-
Transistor Count
25 Billion
Transistor Count
-
Transistor Density
164 MTr/mm²
Transistor Density
-

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