Apple FirePro D300 vs Intel HD 3000 1200MHz Full Specs
1,280 Shaders 850MHz | 96 Shaders 1.2GHz |
2GB GDDR5162.6GB/s placeholder | Shared Memory25.6GB/sDDR3 |
·· 2.18 TFLOPS | ·· 230.4 GFLOPS |
Form Factor Mac Pro Card | Form Factor iGPU |
TDP 150W | TDP Shared |
FirePro D3002.18 TFLOPSFP32
HD 3000 1200MHz230.4 GFLOPSFP32Clock Speed ·· | Clock Speed ··· |
Peak OPS 2.18 TFLOPSFP32 | Peak OPS 230.4 GFLOPSFP32 |
FP32 2.18 TFLOPS | FP32 230.4 GFLOPS |
FP64 136 GFLOPS | - |
Pixel Rate 27.2 GPixel/s | Pixel Rate 2.4 GPixel/s |
Texture Rate 68 GTexel/s | Texture Rate 14.4 GTexel/s |
Shaders 1,280 Shaders | Shaders 96 Shaders |
TMUs 80 TMUs | TMUs 12 TMUs |
ROPs 32 ROPs | ROPs 2 ROPs |
CUs 20 CUs | EUs 12 EUs |
Base Clock - | Base Clock 650MHz |
Boost Clock 850MHz | Boost Clock 1.2GHz |
L2 Cache 512KB shared | L2 Cache - |
2GB GDDR5 placeholder | Shared MemoryDDR3 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 5.1GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 162.6GB/s | Memory Bandwidth 25.6GB/s |
ECC No | ECC No |
TDP 150W | TDP Shared |
Multi-Monitor 3 | Multi-Monitor 2 |
Encoder Model VCE 1.0 | Encoder Model Quick Sync Video 1 |
Decoder Model UVD 4.0 | Decoder Model Quick Sync Video 1 |
Form Factor Mac Pro Card | Form Factor iGPU |
Cooling Passive | Cooling Open-Air |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Pitcairn | Codename Sandy Bridge |
Chip Variant Pitcairn Pro | Chip Variant GT1 |
Market Segment Workstation | Market Segment Smartphone |
Release Date Jan 18, 2014 | Release Date Feb 1, 2011 |
Foundry TSMC | Foundry Intel |
Fabrication Node 28nm | Fabrication Node 32nm |
Die Size 212mm² | Die Size 216mm² |
Transistor Count 2.8 Billion | Transistor Count 1.2 Billion |
Transistor Density 13.21 MTr/mm² | Transistor Density 5 MTr/mm² |
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