ARM Mali-G52 MP2 850MHz vs Apple 8-Core M1-FL Full Specs

Summary

24 Shaders 850MHz	1,024 Shaders 1.28GHz
Shared Memory14.9GB/s LPDDR4X·LPDDR4·LPDDR3	Shared Memory68.3GB/sLPDDR4X
Peak·FP32·FP16 40.8 GFLOPS	Peak·FP32·FP16 2.62 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed850MHz UC·Boost·OC	Clock Speed1278MHz UC·Boost·OC
Peak OPS 81.6 GFLOPSFP16	Peak OPS 2.62 TFLOPSFP16
FP32 40.8 GFLOPS	FP32 2.62 TFLOPS
Pixel Rate 1.7 GPixel/s	Pixel Rate 40.9 GPixel/s
Texture Rate 1.7 GTexel/s	Texture Rate 81.8 GTexel/s

Core Config

Shaders 24 Shaders	Shaders 1,024 Shaders
TMUs 2 TMUs	TMUs 64 TMUs
ROPs 2 ROPs	ROPs 32 ROPs
EUs 6 EUs	EUs 128 EUs

Clocks

Boost Clock 850MHz

Boost Clock 1.28GHz

Cache

L2 Cache -

L2 Cache 768KB shared

Memory

Shared Memory LPDDR4X·LPDDR4·LPDDR3	Shared MemoryLPDDR4X
Memory Bus 32-bit	Memory Bus 128-bit
Memory Speed 3.7GT/s	Memory Speed 4.3GT/s
Memory Bandwidth 14.9GB/s	Memory Bandwidth 68.3GB/s
ECC No	ECC No

Video Output

Multi-Monitor -

Multi-Monitor 1

Encoder

-	Encoder Model Apple Media Engine 1
Codec -	Codec AVC (H.264) HEVC (H.265)

Decoder

-	Decoder Model Apple Media Engine 1
Codec -	Codec AVC (H.264) HEVC (H.265)

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer ARM	Manufacturer Apple
Chip Designer ARM	Chip Designer Apple
Architecture Bifrost 2	Architecture Apple Gen 4
Family Series 2	Family M Series
Branding	Branding
Codename -	Codename G13G
Market Segment Smartphone	Market Segment Tablet
Release Date Aug 1, 2019	Release Date Nov 10, 2020

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N7	Fabrication Node N5
Die Size -	Die Size 123mm²
Transistor Count -	Transistor Count 16 Billion
Transistor Density -	Transistor Density 130 MTr/mm²

Images