GPUs

ATI Radeon X850 Pro vs NVIDIA GeForce RTX 3050 6GB Full Specs

12 Shaders
507MHz
2,304 Shaders
1.47GHz
262MB GDDR333.3GB/s
6GB GDDR6168GB/s
··
-
··
6.77 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
60W
TDP
70W
Power Connectors
1x 6-Pin
Power Connectors
-

Radeon X850 ProRadeon X850 Pro-
-
GeForce RTX 3050 6GBGeForce RTX 3050 6GB216.8 TOPSINT4 Tensor Sparse
x1

Clock Speed
··
Clock Speed
···
Peak OPS
-
Peak OPS
216.8 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.1 TFLOPS
FP16-16 Tensor Sparse
54.19 TFLOPS
Tensor FP16-32
13.55 TFLOPS
FP16-32 Tensor Sparse
27.1 TFLOPS
-
BF16
6.77 TFLOPS
Tensor BF16
13.55 TFLOPS
BF16 Tensor Sparse
27.1 TFLOPS
Tensor TF32
-
Tensor TF32
6.77 TFLOPS
-
FP32
6.77 TFLOPS
-
FP64
105.8 GFLOPS
Tensor INT4
-
Tensor INT4
108.4 TOPS
-
Tensor INT8
54.19 TOPS
Ray
-
Ray
10.22 TOPS
Pixel Rate
8.1 GPixel/s
Pixel Rate
47 GPixel/s
Texture Rate
6.1 GTexel/s
Texture Rate
105.8 GTexel/s

Shaders
12 Shaders
Shaders
2,304 Shaders
TMUs
12 TMUs
TMUs
72 TMUs
ROPs
16 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
Units
-
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
507MHz
Boost Clock
1.47GHz

L2 Cache
-
L2 Cache
2MB shared

262MB GDDR3
6GB GDDR6
Memory Bus
256-bit
Memory Bus
96-bit
Memory Speed
1GT/s
Memory Speed
14GT/s
Memory Bandwidth
33.3GB/s
Memory Bandwidth
168GB/s

TDP
60W
TDP
70W

Multi-Monitor
2
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
3x DisplayPort 1.4
-
1x HDMI 2.1
1x DVI-I Dual-Link
-
1x VGA
-
1x S-Video
-

-
Encoder Model
NVENC 7

-
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
1.9-Slots
-
Height
112 mm (4.41")
Width
242 mm (9.53")
Depth
38 mm (1.5")
Cooling
Blower
1x Fan
Cooling
Open-Air
2x Fans
Power Connectors
1x 6-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2005 branding
Branding
GeForce RTX 2018 branding
Codename
Thor
Codename
NV177
Chip Variant
-
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Dec 1, 2004
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
130nm
Fabrication Node
8N
Die Size
281mm²
Die Size
200mm²
Transistor Count
160 Million
Transistor Count
8.7 Billion
Transistor Density
0.57 MTr/mm²
Transistor Density
43.5 MTr/mm²

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