GIGABYTE GeForce RTX 3060 Ti Gaming OC Pro vs Intel Arc A750 Full Specs
4,864 Shaders 1.77GHz | 3,584 Shaders 2.4GHz |
8GB GDDR6448GB/s | 8GB GDDR6512GB/s |
·· 17.22 TFLOPS | ·· 17.2 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 200W | TDP 225W |
Power Connectors 1x 8-Pin 1x 6-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 551 TOPSINT4 Tensor Sparse | Peak OPS 550.5 TOPSINT4 Tensor |
Tensor FP16-16 68.87 TFLOPSFP16-16 Tensor Sparse 137.7 TFLOPSTensor FP16-32 34.44 TFLOPSFP16-32 Tensor Sparse 68.87 TFLOPS | Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 137.6 TFLOPSFP16-32 Tensor Sparse - |
BF16 17.22 TFLOPSTensor BF16 34.44 TFLOPSBF16 Tensor Sparse 68.87 TFLOPS | BF16 -Tensor BF16 137.6 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 17.22 TFLOPS | Tensor TF32 - |
FP32 17.22 TFLOPS | FP32 17.2 TFLOPS |
FP64 269 GFLOPS | FP64 4.3 TFLOPS |
Tensor INT4 275.5 TOPS | Tensor INT4 550.5 TOPS |
Tensor INT8 137.7 TOPS | Tensor INT8 275.3 TOPS |
Ray 25.97 TOPS | Ray - |
Pixel Rate 141.6 GPixel/s | Pixel Rate 268.8 GPixel/s |
Texture Rate 269 GTexel/s | Texture Rate 537.6 GTexel/s |
Shaders 4,864 Shaders | Shaders 3,584 Shaders |
TMUs 152 TMUs | TMUs 224 TMUs |
ROPs 80 ROPs | ROPs 112 ROPs |
Tensor Cores 152 T-Cores | Tensor Cores 448 T-Cores |
RT Cores 38 RT-Cores | RT Cores 28 RT-Cores |
SMs 38 SMs | EUs 448 EUs |
Base Clock 1.41GHz | Base Clock 2.05GHz |
Boost Clock 1.77GHz | Boost Clock 2.4GHz |
L2 Cache 4.1MB shared | L2 Cache 8.2MB shared |
8GB GDDR6 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 14GT/s | Memory Speed 16GT/s |
Memory Bandwidth 448GB/s | Memory Bandwidth 512GB/s |
ECC No | ECC No |
TDP 200W | TDP 225W |
Max Temp 93°C Max | Max Temp - |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
- | 3x DisplayPort 2.0 |
2x DisplayPort 1.4 | - |
2x HDMI 2.1 | 1x HDMI 2.1 |
Encoder Model NVENC 7 | Encoder Model Arc |
Decoder Model NVDEC 5 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 117 mm (4.61")Width 281 mm (11.06")Depth 40 mm (1.57") | Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") |
Cooling Open-Air 2x Fans | Cooling Open-Air 2x Fans |
Power Connectors 1x 8-Pin, 1x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV174 | Codename Xe HPG |
Chip Variant GA104-150-A1 | Chip Variant DG2-512 |
Market Segment Desktop | Market Segment Desktop |
Release Date Dec 2, 2020 | Release Date Oct 14, 2022 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N6 |
Die Size 393mm² | Die Size 406mm² |
Transistor Count 17.4 Billion | Transistor Count 21.7 Billion |
Transistor Density 44.33 MTr/mm² | Transistor Density 53.45 MTr/mm² |
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