Intel Arc 130V 1850MHz vs Intel Arc A370M Full Specs

Summary

896 Shaders 1.85GHz	1,024 Shaders 1.55GHz
Shared Memory136.5GB/sLPDDR5X	4GB GDDR6112GB/s placeholder
Peak·FP32·FP16 3.31 TFLOPS	Peak·FP32·FP16 3.17 TFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 35W

Theoretical Performance

Clock Speed1850MHz UC·Boost·OC	Clock Speed1550MHz UC·Base·Boost·OC
Peak OPS 106.1 TOPSINT4 Tensor	Peak OPS 101.6 TOPSINT4 Tensor
Tensor FP16-32 26.52 TFLOPS	Tensor FP16-32 25.4 TFLOPS
Tensor BF16 26.52 TFLOPS	Tensor BF16 25.4 TFLOPS
FP32 3.31 TFLOPS	FP32 3.17 TFLOPS
FP64 828.8 GFLOPS	FP64 793.6 GFLOPS
Tensor INT4 106.1 TOPS	Tensor INT4 101.6 TOPS
Tensor INT8 53.04 TOPS	Tensor INT8 50.79 TOPS
Pixel Rate 51.8 GPixel/s	Pixel Rate 49.6 GPixel/s
Texture Rate 103.6 GTexel/s	Texture Rate 99.2 GTexel/s

Core Config

Shaders 896 Shaders	Shaders 1,024 Shaders
TMUs 56 TMUs	TMUs 64 TMUs
ROPs 28 ROPs	ROPs 32 ROPs
Tensor Cores 56 T-Cores	Tensor Cores 128 T-Cores
RT Cores 7 RT-Cores	RT Cores 8 RT-Cores
EUs 56 EUs	EUs 128 EUs

Clocks

Base Clock -	Base Clock 300MHz
Boost Clock 1.85GHz	Boost Clock 1.55GHz

Cache

L2 Cache 7MB shared

L2 Cache 4MB shared

Memory

Shared MemoryLPDDR5X	4GB GDDR6 placeholder
Memory Bus 128-bit	Memory Bus 64-bit
Memory Speed 8.5GT/s	Memory Speed 14GT/s
Memory Bandwidth 136.5GB/s	Memory Bandwidth 112GB/s
ECC No	ECC No

Power & Thermals

TDP Shared

TDP 35W

Video Output

Multi-Monitor 3

Multi-Monitor 4

Encoder

Encoder Model Xe Media Engine	Encoder Model Arc
Codec VP9 AVC (H.264) HEVC (H.265) AV1	Codec - AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder Model Xe Media Engine	Decoder Model Arc
Codec MPEG-2 JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) VVC (H.266) AV1	Codec MPEG-2 JPEG - - VP9 AVC (H.264) HEVC (H.265) - AV1

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer Intel
Chip Designer Intel	Chip Designer Intel
Architecture Battlemage	Architecture Alchemist
Family Gen 13	Family Arc A
Branding	Branding
Codename Xe2 LPG	Codename Xe HPG
Chip Variant GT2	Chip Variant DG2-128
Market Segment Laptop	Market Segment Laptop
Release Date Sep 3, 2024	Release Date Mar 30, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3B	Fabrication Node N6
Die Size 140mm²	Die Size 157mm²
Transistor Count -	Transistor Count 7.2 Billion
Transistor Density -	Transistor Density 45.86 MTr/mm²

Images