Intel Arc 7C 2200MHz vs Intel Flex 170V Full Specs

Summary

896 Shaders 2.2GHz	4,096 Shaders 2.05GHz
Shared Memory119.5GB/s LPDDR5X·DDR5	16GB GDDR6576GB/s placeholder
Peak·FP32·FP16 3.94 TFLOPS	Peak·FP32·FP16 -
Form Factor iGPU	Form Factor PCIe Card
TDP Shared	TDP 150W

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth TDP

Arc 7C 2200MHz7.88 TFLOPSFP16

x1

Flex 170V-

-

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Theoretical Performance

Clock Speed2200MHz UC·Boost·OC	Clock Speed2050MHz UC·Boost·OC
Peak OPS 7.88 TFLOPSFP16	Peak OPS -
FP32 3.94 TFLOPS	-
FP64 985.6 GFLOPS	-
Pixel Rate 61.6 GPixel/s	Pixel Rate -
Texture Rate 123.2 GTexel/s	Texture Rate -

Core Config

Shaders 896 Shaders	Shaders 4,096 Shaders
TMUs 56 TMUs	TMUs -
ROPs 28 ROPs	ROPs -
Tensor Cores -	Tensor Cores 512 T-Cores
RT Cores 7 RT-Cores	RT Cores 32 RT-Cores
EUs 112 EUs	EUs 512 EUs

Clocks

Boost Clock 2.2GHz	Boost Clock 2.05GHz
Tensor Clock -	Tensor Clock 1.5GHz

Cache

L1 -	L1 192KB/Xe-core

Memory

Shared Memory LPDDR5X·DDR5	16GB GDDR6 placeholder
Memory Bus 128-bit	Memory Bus 256-bit
Memory Speed 7.5GT/s	Memory Speed 18GT/s
Memory Bandwidth 119.5GB/s	Memory Bandwidth 576GB/s
ECC No	ECC -

Power & Thermals

TDP Shared

TDP 150W

Video Output

Max Resolution 7680x4320	Max Resolution 7680x4320
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz
Multi-Monitor 4	Multi-Monitor -
Adaptive Sync -	Adaptive Sync FreeSync
DSC Supported	DSC -

API Support

Shader Model 6.4	Shader Model 6.6
DirectX DirectX 12 Direct3D 12_1	DirectX DirectX 12 Direct3D 12_2
OpenGL 4.6 OpenCL 3 Vulkan 1.2	OpenGL 4.6 OpenCL 3 Vulkan 1.3

Encoder

Encoder Arc	Encoder 2x Flex 170V
Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1	Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder Arc	Decoder 2x Flex 170V
Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor iGPU	Form Factor PCIe Card
PCIe -	PCIe PCIe 4.0 x16

Chip

Manufacturer Intel	Manufacturer Intel
Chip Designer Intel	Chip Designer Intel
Architecture Alchemist	Architecture Alchemist
Family Gen 12	Family Flex
Branding	Branding
Codename Xe LPG	Codename Xe HPG
Chip Variant GT1	Chip Variant -
Market Segment Laptop	Market Segment Server
Release Date Dec 14, 2023	Release Date Jul 1, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N5	Fabrication Node N6
Die Size 23mm²	Die Size 406mm²
Transistor Count -	Transistor Count 21.7B
Transistor Density -	Transistor Density 53.45 MTr/mm²

Images