Intel Arc 8C 2250MHz vs Apple 16-Core M4 Pro Full Specs

Summary

1,024 Shaders 2.25GHz	2,048 Shaders 1.58GHz
Shared Memory119.5GB/s LPDDR5X·DDR5	Shared Memory273.1GB/sLPDDR5X
Peak·FP32·FP16 4.61 TFLOPS	Peak·FP32·FP16 6.46 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth

Arc 8C 2250MHz9.22 TFLOPSFP16

x1.43

16-Core M4 Pro6.46 TFLOPSFP16

x1

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Theoretical Performance

Clock Speed2250MHz UC·Boost·OC	Clock Speed1578MHz UC·Boost·OC
Peak OPS 9.22 TFLOPSFP16	Peak OPS 6.46 TFLOPSFP16
FP32 4.61 TFLOPS	FP32 6.46 TFLOPS
FP64 1.15 TFLOPS	-
Pixel Rate 72 GPixel/s	Pixel Rate 101 GPixel/s
Texture Rate 144 GTexel/s	Texture Rate 202 GTexel/s

Core Config

Shaders 1,024 Shaders	Shaders 2,048 Shaders
TMUs 64 TMUs	TMUs 128 TMUs
ROPs 32 ROPs	ROPs 64 ROPs
RT Cores 8 RT-Cores	RT Cores 16 RT-Cores
EUs 128 EUs	EUs 256 EUs

Clocks

Boost Clock 2.25GHz

Boost Clock 1.58GHz

Cache

L2 Cache -

L2 Cache 4MB shared

Memory

Shared Memory LPDDR5X·DDR5	Shared MemoryLPDDR5X
Memory Bus 128-bit	Memory Bus 256-bit
Memory Speed 7.5GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 119.5GB/s	Memory Bandwidth 273.1GB/s
ECC No	ECC No

Video Output

Max Resolution 7680x4320	Max Resolution 7680x4320
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 120Hz
Multi-Monitor 4	Multi-Monitor 3
DSC Supported	DSC Supported

API Support

Shader Model 6.4	Shader Model -
DirectX DirectX 12 Direct3D 12_1	-
OpenGL 4.6 OpenCL 3 Vulkan 1.2	-

Encoder

Encoder Arc	Encoder Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) AV1 -	Codec AVC (H.264) HEVC (H.265) - ProRes

Decoder

Decoder Arc	Decoder Apple Media Engine 3
Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1 -	Codec - - - AVC (H.264) HEVC (H.265) AV1 ProRes

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Intel	Manufacturer Apple
Chip Designer Intel	Chip Designer Apple
Architecture Alchemist	Architecture Apple Gen 7
Family Gen 12	Family M Series
Branding	Branding
Codename Xe LPG	Codename G16S
Chip Variant GT1	Chip Variant -
Market Segment Laptop	Market Segment Laptop
Release Date Dec 14, 2023	Release Date Oct 29, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N5	Fabrication Node N3E
Die Size 23mm²	Die Size 325mm²
Transistor Count -	Transistor Count 55B
Transistor Density -	Transistor Density 169 MTr/mm²

Images