Intel Arc 8C 2300MHz vs Intel Arc A370E Full Specs

Summary

1,024 Shaders 2.3GHz	1,024 Shaders -
Shared Memory119.5GB/s LPDDR5X·DDR5	4GB GDDR6112GB/s placeholder
Peak·FP32·FP16 4.71 TFLOPS	Peak·FP32·FP16 -
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 50W

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth TDP

Arc 8C 2300MHz9.42 TFLOPSFP16

x1

Arc A370E-

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Theoretical Performance

Clock Speed2300MHz UC·Boost·OC	-
Peak OPS 9.42 TFLOPSFP16	Peak OPS -
FP32 4.71 TFLOPS	-
FP64 1.18 TFLOPS	-
Pixel Rate 73.6 GPixel/s	Pixel Rate -
Texture Rate 147.2 GTexel/s	Texture Rate -

Core Config

Shaders 1,024 Shaders	Shaders 1,024 Shaders
TMUs 64 TMUs	TMUs 64 TMUs
ROPs 32 ROPs	ROPs 32 ROPs
Tensor Cores -	Tensor Cores 128 T-Cores
RT Cores 8 RT-Cores	RT Cores 8 RT-Cores
EUs 128 EUs	EUs 128 EUs

Clocks

Base Clock -	Base Clock 1.55GHz
Boost Clock 2.3GHz	Boost Clock -

Cache

L1 -	L1 192KB/Xe-core
L2 Cache -	L2 Cache 4MB shared

Memory

Shared Memory LPDDR5X·DDR5	4GB GDDR6 placeholder
Memory Bus 128-bit	Memory Bus 64-bit
Memory Speed 7.5GT/s	Memory Speed 14GT/s
Memory Bandwidth 119.5GB/s	Memory Bandwidth 112GB/s
ECC No	ECC -

Power & Thermals

TDP Shared

TDP 50W

Video Output

Max Resolution 7680x4320	Max Resolution 7680x4320
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz
Multi-Monitor 4	Multi-Monitor 4
Adaptive Sync -	Adaptive Sync FreeSync
DSC Supported	DSC -

API Support

Shader Model 6.4	Shader Model 6.6
DirectX DirectX 12 Direct3D 12_1	DirectX DirectX 12 Direct3D 12_2
OpenGL 4.6 OpenCL 3 Vulkan 1.2	OpenGL 4.6 OpenCL 3 Vulkan 1.3

Encoder

Encoder Arc	Encoder 2x Arc
Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1	Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder Arc	Decoder 2x Arc
Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor iGPU	Form Factor Soldered
PCIe -	PCIe PCIe 4.0 x8

Chip

Manufacturer Intel	Manufacturer Intel
Chip Designer Intel	Chip Designer Intel
Architecture Alchemist	Architecture Alchemist
Family Gen 12	Family Arc A
Branding	Branding
Codename Xe LPG	Codename Xe HPG
Chip Variant GT1	Chip Variant DG2-128
Market Segment Laptop	Market Segment Embedded
Release Date Dec 14, 2023	Release Date Apr 1, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N5	Fabrication Node N6
Die Size 23mm²	Die Size 157mm²
Transistor Count -	Transistor Count 7.2B
Transistor Density -	Transistor Density 45.86 MTr/mm²

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